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Telit Wireless Solutions SE868SY-D Скачать руководство пользователя страница 31

SE868SY-D Hardware Design Guide

1VV0301705 Rev. 5

Page 31 of 44

2021-12-15

Not Subject to NDA

Finish

Layer Thickness (um)

Properties

Electro-less Ni / Immersion Au

3

–

7 / 0.03

–

0.15

Good solderability protection, high shear
force values

Table 24: Recommendations for PCB Pad Surfaces

The PCB must be able to resist the higher temperatures that occur during the lead-free
process. This issue should be discussed with the PCB-supplier. In general, the wettability
of tin-lead solder paste on the described surface plating is better compared to lead-free
solder paste.

It is not necessary to panel the application’s

PCB, however, in that case, milled contours

and predrilled board breakouts are recommended; scoring or v-cut solutions are not
recommended.

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Содержание SE868SY-D

Страница 1: ...SE868SY D HW Design Guide 1VV0301705 Rev 5 2021 12 15 Telit Technical Documentation...

Страница 2: ...SE868SY D Hardware Design Guide 1VV0301705 Rev 5 Page 2 of 44 2021 12 15 Not Subject to NDA APPLICABILITY TABLE PRODUCTS SE868SY D...

Страница 3: ...iants and Supported Satellite Systems 8 Target Market 8 Block Diagram 9 Main Features 9 Mechanical Specifications 10 2 6 1 Dimensions 10 2 6 2 Weight 10 Temperature Range 10 Magnetic Field Immunity 10...

Страница 4: ...to First Fix 22 Sensitivity 22 7 RF SECTION 24 GNSS RF Signal Pin Out 24 RF Front End Design 24 7 2 1 Reference Design for Passive Antenna 24 7 2 2 Reference Design for Active Antenna 25 7 2 3 Guideli...

Страница 5: ...Conformity 37 12 PRODUCT AND SAFETY INFORMATION 38 Copyrights and Other Notices 38 12 1 1 Copyrights 38 12 1 2 Computer Software Copyrights 38 Usage and Disclosure Restrictions 39 12 2 1 License Agree...

Страница 6: ...proper product development with the Telit module Audience This document is intended for Telit customers especially system integrators about to implement their applications using our SE868SY D modules...

Страница 7: ...ailure or personal injury may occur Warning Alerts the user on important steps about the module integration Note Tip Provides advice and suggestions that may be useful when integrating the module Elec...

Страница 8: ...wearable device applications Product Variants and Supported Satellite Systems The SE868SY D is available in two different ordering part numbers Standard Low power requiring an external 0 8 V voltage...

Страница 9: ...D Block Diagram Main Features Function Features GNSS Multi constellation and Multi bands Low power consumption Geofence in progress Real Time Clock Interfaces Main UART SPI 1 I2C 1PPS signal LNA_EN SY...

Страница 10: ...on operating Temperature Range 40 C 85 C Table 4 Temperature Range Magnetic Field Immunity Since the SE868SY D uses an embedded MRAM as an NVM Non Volatile Memory for its program code and data storage...

Страница 11: ...TAL 1 8V 2nd function SPI CS HIF 3rd function GPIO 24 UART_RTS I O 1st function UART RTS HIF DIGITAL 1 8V 2nd function SPI MISO HIF 3rd function GPIO DIGITAL IO 5 SYS_ON1 O System On active HIGH DIGIT...

Страница 12: ...Ground 7 GND Ground 9 GND Ground 21 GND Ground 31 GND Ground RESERVED FOR FUTURE USE RFU 2 RFU RFU 3 RFU RFU 5 RFU3 RFU See SYS_ON 6 RFU RFU 14 RFU RFU 15 RFU RFU 16 RFU RFU 17 RFU RFU 18 RFU RFU 22...

Страница 13: ...SE868SY D Hardware Design Guide 1VV0301705 Rev 5 Page 13 of 44 2021 12 15 Not Subject to NDA Warning Reserved pins must not be connected LGA Pads Layout TOP VIEW Figure 2 LGA Pads Layout...

Страница 14: ...8 0 9 V RF Input Power Pin 8 20 dBm ESD Voltage CDM JESD22 C101F All Pins 150 V ESD Voltage HDM JEDEC JS 001 2017 All pins 1500 V V ESD Voltage on Antenna PIN IEC 61000 4 2 Pin 8 8 kV kV Supply Volta...

Страница 15: ...ltage 1 8 V On Pin 25 27 and 32 in Standard P N On Pin 25 and 32 in Low Power P N 0 8 V On Pin 27 ONLY in Low Power P N Operating Voltage Range 1 71 1 89 V On Pin 25 27 and 32 in Standard P N On Pin 2...

Страница 16: ...r consumption General Design Rules The principal guidelines for the Power Supply Design embrace three different design steps Electrical design Thermal design PCB layout 4 3 1 Electrical Design Guideli...

Страница 17: ...electrolytic capacitors are not recommended at the module input due to their high ESR When Tantalum capacitors are chosen a minimum value of 10 F is recommended in parallel with a 0 1 F ceramic capaci...

Страница 18: ...Telit SE868SY D power input pads in case the power supply is a switching type it can be placed close to the switching inductor to reduce ripple In case a switching power regulator is used it is impor...

Страница 19: ...Interface Selection pin See section 5 2 2 Host Interface Selection HIF_UART serial interface supporting speeds up to 10Mbps Function Pin on SE868SY D HIF_UART_TX 10 HIF_UART_RX 11 HIF_UART_CTS 23 HIF_...

Страница 20: ...ce HIF options described in the previous section can be selected in the SE868SY D via two pins HIF_SEL_0 and HIF_SEL_1 whose values are checked when the power is turned ON HIF_SEL_0 and HIF_SEL_1 are...

Страница 21: ...d to the RF path For improved EMI performance a maximum external gain of 8 dB is recommended however a gain up to 33 dB can be accepted as shown in the table below Gain Internal Gain External Gain Ran...

Страница 22: ...Live rooftop antenna Table 18 SE868SY D Horizontal Position Accuracy Time to First Fix Constellations s Band Start Type AVG TTFF s GPS L1 Hot 1 Cold 29 GPS L1 L5 Hot 1 Cold 29 GPS GLO GAL QZSS BDS L1...

Страница 23: ...Page 23 of 44 2021 12 15 Not Subject to NDA Constellation s Bands State Minimum Signal Level dBm GPS GLO GAL QZSS BDS L1 L5 Acquisition 146 Navigation 162 Tracking 164 Test conditions Static scenario...

Страница 24: ...d QZSS GNSS RF Signal Pin Out Pin Signal I O Function Type 8 RF_IN I L1 L5 RF signal input Analog RF Table 21 GNSS RF Signal Pin Out RF Front End Design The SE868SY D Module embeds an internal LNA but...

Страница 25: ...Design for Active Antenna 7 2 3 Guidelines of PCB Line for GNSS Antenna When using the SE868SY D since there is no antenna connector on the module the antenna must be connected to the SE868SY D antenn...

Страница 26: ...ing it inside the layers of PCB and surrounding it with Ground planes or shielding it with a metal frame cover If there are not EM noisy devices around the PCB hosting the module use a strip line on t...

Страница 27: ...s not supplied by the SE868SY D module but can be easily included by the host design The electrical characteristics of the LNA_EN signal are as follows Table 23 LNA_EN Signal Electrical Characteristic...

Страница 28: ...SY D Hardware Design Guide 1VV0301705 Rev 5 Page 28 of 44 2021 12 15 Not Subject to NDA 8 MECHANICAL DESIGN Drawing Figure 8 Mechanical Design Drawing Note Dimensions in mm The tolerance is not cumula...

Страница 29: ...ded Footprint for the Application 0 45 1 1 7 45 10 4 10 95 7 45 10 4 10 95 Pin1 Non Solder Mask Defined Pads 32 Places Figure 9 Copper Pattern top view To make it easier to rework the SE868SY D it is...

Страница 30: ...ad Recommendations Pad design shall comply with the following specification Figure 11 Pad Design Specifications Note Dimensions in mm It is not recommended to place vias or micro vias not covered by s...

Страница 31: ...rfaces The PCB must be able to resist the higher temperatures that occur during the lead free process This issue should be discussed with the PCB supplier In general the wettability of tin lead solder...

Страница 32: ...te It is recommended to use a no Clean process to avoid the cleaning of the modules after assembly Solder Reflow Figure 12 Recommended Solder Reflow Profile Warning The solder reflow profile shown abo...

Страница 33: ...max to TL Ramp up Rate 3 C second max Time maintained above Temperature TL Time tL 217 C 60 150 seconds Peak Temperature Tp 245 0 5 C Time within 5 C of actual Peak Temperature tp 10 30 seconds Ramp d...

Страница 34: ...SE868SY D Hardware Design Guide 1VV0301705 Rev 5 Page 34 of 44 2021 12 15 Not Subject to NDA 10 PACKAGING Reel Figure 13 Modules Shipped in Reel Form...

Страница 35: ...SE868SY D Hardware Design Guide 1VV0301705 Rev 5 Page 35 of 44 2021 12 15 Not Subject to NDA Tray Figure 14 Modules Shipped in Tray Form...

Страница 36: ...SE868SY D Hardware Design Guide 1VV0301705 Rev 5 Page 36 of 44 2021 12 15 Not Subject to NDA Figure 15 Packaging Detail...

Страница 37: ...mity is available at the following internet address http www telit com red Text of 2014 53 EU Directive RED requirements can be found here https eur lex europa eu legal content EN TXT uri CELEX 32014L...

Страница 38: ...necessarily mean that Telit intends to announce such Telit products programming or services in your country 12 1 1 Copyrights This instruction manual and the Telit products described herein may includ...

Страница 39: ...is document is owned by Telit and its licensors It is furnished by express license agreement only and shall be used exclusively in accordance with the terms of such agreement 12 2 2 Copyrighted Materi...

Страница 40: ...FOR A PARTICULAR PURPOSE NO THIRD PARTY LICENSORS OF OTHER CODES MUST BE LIABLE FOR ANY DIRECT INDIRECT INCIDENTAL SPECIAL EXEMPLARY OR CONSEQUENTIAL DAMAGES INCLUDING WITHOUT LIMITATION LOST OF PROFI...

Страница 41: ...the product itself The system integrator is responsible for the functioning of the final product Therefore the external components of the module as well as any project or installation issue must be ha...

Страница 42: ...n Satellite System GPIO General Purpose Input Output I O Input Output I2C Inter Integrated Circuit LNA Low Noise Amplifier MISO Master In Slave Out MOSI Master Out Slave In NMEA National Marine Electr...

Страница 43: ...Absolute Maximum Ratings 11 2 UKCA Declaration of Conformity Updated document to new Telit Template standards Minor editorial changes 4 2021 10 01 Minor changes to the language and the layout Updated...

Страница 44: ......

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