Telit Wireless Solutions SE868SY-D, Руководство по конструкции аппаратуры, Страница: 29 / 44

SE868SY-D Hardware Design Guide
1VV0301705 Rev. 5 Page 29 of 44 2021-12-15
Not Subject to NDA
9. Application PCB Design
The SE868SY-D modules have been designed to comply with a standard lead-free SMT
process.
Recommended Footprint for the Application
0,45
1
1
7,45 10,4
10,95
7,45
10,4
10,95
Pin1
Non Solder Mask Defined Pads 32 Places
Figure 9: Copper Pattern (top view)
To make it easier to rework the SE868SY-D,it is recommended to consider a 2mm
placement inhibit area around the module on the application.
As a general rule for an SMT component, avoid having any mechanical part of the
application in direct contact with the module.