SE868-V3 Product User Guide
1VV0301205 r4 – 2016-01-20
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
Page 65 of 76
Mod. 0805 2015-02 Rev.4
Further information can be obtained from the JEDEC standard
JESD625-A Requirements
for Handling Electrostatic Discharge Sensitive (ESDS) Devices
which can be downloaded
14.5.
Reflow
The modules are compatible with lead free soldering processes as defined in
IPC/JEDEC J-
STD-020
. The reflow profile must not exceed the profile given
IPC/JEDEC J-STD-020
Table
5-2, “Classification Reflow Profiles”. Although
IPC/JEDEC J-STD-020
allows for three
reflows, the assembly process for the module uses one of those profiles, therefore the module
is limited to two reflows.
When re-flowing a dual-sided SMT board, it is important to reflow the side containing the
module last. This prevents heavier components within the module from becoming dislodged if
the solder reaches liquidus temperature while the module is inverted.
Note
: JEDEC standards are available for free from the JEDEC website
Please note that the JEDEC document includes important information in addition to
the above figure.
14.6.
Assembly Considerations
Since the module contains piezo-electric components, it should be placed near the end of the
assembly process to minimize mechanical shock to it. During board singulation, pay careful
attention to unwanted vibrations and resonances introduced into the board assembly by the
board router.
14.7.
Washing Considerations
The module can be washed using standard PCB cleaning procedures after assembly. The shield
does not provide a water seal to the internal components of the module, so it is important that
the module be thoroughly dried prior to use by blowing excess water and then baking the
module to drive residual moisture out. Depending upon the board cleaning equipment, the
drying cycle may not be sufficient to thoroughly dry the module, so additional steps may need
to be taken. Exact process details will need to be determined by the type of washing equipment
as well as other components on the board to which the module is attached. The module itself
can withstand standard JEDEC baking procedures.
14.8.
Safety
Improper handling and use of this module can cause permanent damage to it. There is also the
possible risk of personal injury from mechanical trauma or choking hazard.