SE868-V3 Product User Guide
1VV0301205 r4 – 2016-01-20
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
Page 63 of 76
Mod. 0805 2015-02 Rev.4
14.3.
Moisture Sensitivity
Precautionary measures are required in handling, storing and using these devices to avoid
damage from moisture absorption. If localized heating is required to rework or repair the device,
precautionary methods are required to avoid exposure to solder reflow temperatures that can
result in performance degradation.
The receiver module has a moisture sensitivity level rating of 3 as defined
by IPC/JEDEC J-
STD-020
. This rating is assigned due to some of the components used within the module.
Please follow the MSD and ESD handling instructions on the labels of the MBB and exterior
carton.
The SE868-V3 is supplied in trays or tape and reel and is hermetically sealed with desiccant
and humidity indicator card. The SE868-V3 parts must be placed and reflowed within 168 hours
of first opening the hermetic seal provided the factory conditions are less than 30°C and less
than 60% R. H. and the humidity indicator card indicates less than 10% relative humidity.
If the package has been opened or the humidity indicator card indicates above 10%, then the
parts must be baked prior to reflow. The parts may be baked at +125°C ± 5°C for 48 hours.
However, the tray or the tape and reel can NOT withstand that temperature. Lower temperature
baking is feasible if the humidity level is low and time is available. Please see
IPC/JEDEC J-
STD-033
“Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount
Devices” for additional information.
Additional information can be found on the MSL tag affixed to the outside of the hermetically
sealed bag.
JEDEC standards are available free of charge from the JEDEC website