SE868-V3 Product User Guide
1VV0301205 r4 – 2016-01-20
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
Page 12 of 76
Mod. 0805 2015-02 Rev.4
2.
Product Description
The SE868-V3 modules are complete multi-constellation position, velocity, and time (PVT)
engines featuring high performance, high sensitivity, and low power consumption. These
modules are capable of excellent performance in harsh environments. The inclusion of the
GLONASS and BeiDou constellations yields better coverage, greater accuracy, and improved
availability.
The SE868-V3 module is based on the SiRFstar 5e (B02) flash GNSS chip.
The SE868-V3 is pin-compatible with the SE868-V2 and JF2 modules with some differences
for drop-in replacement. See
Section 5 Product
Compatibility for details.
2.1.
Product Overview
•
Complete GNSS receiver module including memory, LNA, TCXO, and RTC
•
Based on the SiRFstar 5e (B02) flash GNSS chip
•
Same footprint as JF2 and SE868-V2 modules (see
Product Compatibility
section
•
GPS (L1), QZSS, and either Glonass (L1) or BeiDou (B1) simultaneous ranging
•
Galileo ready
•
SBAS capable (WAAS, EGNOS, MSAS, GAGAN), including ranging
•
AGPS support for extended ephemeris using local or server-based solutions:
o
Client-Generated Extended Ephemeris (CGEE)
o
Server-Generated Extended Ephemeris (SGEE)
•
Jamming Rejection
•
Supports passive or active antenna
•
1PPS output
•
Fix reporting at 1 Hz or 5 Hz
•
NMEA v3.1 command input and data output
•
OSP (binary) command input and data output
•
Standard UART serial port for input commands and output messages
•
The serial port is configurable for UART, I
2
C, or SPI interface
•
Second serial port is configurable for UART or I
2
C interface
•
The Second port may be used for MEMS wakeup (with FW support)
•
16 Megabit built-in flash memory
•
70 mW typical power consumption (Full Power mode, GPS + GLONASS)
•
Power management modes for extended battery life
o
SiRFSmartGNSS I, SiRFSmartGNSS II
o
Push-to-Fix, Trickle Power, SiRFaware
•
Supported by evaluation kits
•
-40°C to +85°C industrial temperature range
•
11 x 11 x 2.62 mm 32-pin QFN package
•
Surface mountable by standard SMT equipment
•
RoHS compliant design