ME910G1 Hardware Design Guide
1VV0301593 Rev.12
Page 31 of 93
2021-09-24
Not Subject to NDA
ME910G1 is wide enough to ensure a voltage dropless connection even during a
0.6 A (LTE) or 2A (GSM) current peak.
•
The protection diode must be placed close to the input connector where the power
source is drained.
•
The PCB
’s
traces from the input connector to the power regulator IC must be wide
enough to ensure no voltage drops occur when an 2 A current peak is absorbed
(valid only for product supporting GSM mode).
•
The PCB traces to the ME910G1 and the Bypass capacitor must be wide enough to
ensure no significant voltage drops occur. This is for the same reason as previous
point. Try to keep this trace as short as possible.
•
To reduce the EMI due to switching, it is important to keep the mesh involved very
small; then the input capacitor, the output diode (if not embodied into the IC) and
the regulator will form a very small loop.This is done to reduce the radiated field
(noise) at the switching frequency (usually 100-500 kHz ).
•
A dedicated ground for the Switching regulator separated from the common
ground plane is suggested.
•
The placement of the power supply on the board must be done in such a way as to
guarantee that the high current return paths in the ground plane do not overlap
with noise sensitive circuitry such as the microphone amplifier/buffer or the
earphone amplifier.
•
Power supply input cables should be kept separate from noise sensitive lines such
as microphone/earphone cables.
•
The insertion of the EMI filter on VBATT pins is recommended in those designs
where antenna is placed near batteries or supply lines. For this purpose, a
Murata
BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 ferrite bead can be used.
The below figure shows the recommended circuit:
Содержание ME910G1
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