HE920 Hardware User Guide
1vv0301014 Rev.9 – 2014-01-23
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights
Reserved.
Page 7 of 84
11.4.1.
Short Description ........................................ 60
11.5.
Indication of Network Service Availability ............. 60
11.6.
RTC Bypass Out ......................................... 61
11.7.
VAUX Power Output ...................................... 61
12.
DAC and ADC section ......................................... 62
12.1.
DAC Converter .......................................... 62
12.1.1.
Description .............................................. 62
12.1.2.
Enabling DAC ............................................. 62
12.1.3.
Low Pass Filter Example .................................. 63
12.2.
ADC Converter .......................................... 63
12.2.1.
Description .............................................. 63
12.2.2.
Using ADC Converter ...................................... 63
13.
Mounting the module on your board ........................... 64
13.1.
General ................................................ 64
13.2.
Module Finishing & Dimensions .......................... 65
13.3.
Recommended foot print for the application ............. 66
13.4.
Stencil ................................................ 67
13.5.
PCB Pad Design ......................................... 67
13.6.
Recommendations for PCB Pad Dimensions (mm) ............ 68
13.7.
Solder Paste ........................................... 70
13.7.1.
Solder Reflow ............................................ 70
14.
Application guide ........................................... 72
14.1.
Debug of the HE920 in production ....................... 72
14.2.
Bypass capacitor on Power supplies ..................... 73
14.3.
SIM interface .......................................... 74
14.3.1.
SIM schematic example .................................... 74
14.4.
EMC recommendations .................................... 75
14.5.
Download and Debug Port ................................ 76
15.
Packing system .............................................. 77
15.1.
Tray Drawing ........................................... 77
15.2.
Moisture Sensibility ................................... 77
16.
Conformity Assessment Issues ................................ 79
