GS2101M Low Power Wi-Fi Module Hardware User Guide
1VV0301395 Rev 3.0
Page
49
of
53
2017-11-13
5.1.1.
Surface Mount Assembly
The following figure shows the reflow profile. The recommended reflow parameters are
summarized in the following table.
Fig. 6 Reflow Temperature Profile
Preheat
Temperature Ramp up rate for (A)
2
1.5~3.5
o
C/s
Pre-heat time (B)
3
80 to 130 seconds
Pre-heat starting temperature (C1)
125 to 135
o
C
Pre-heat ending temperature (C2)
180 to 200
o
C
Heating
5
Peak Temperature range (D)
240 to 250
o
C
Melting time
4
that is the time over 220
o
C (E)
50 to 75 seconds
Cool Down Ramp (F)
>2
o
C/s
Tab. 15 Recommended Reflow Parameters
Notes:
1. Perform an adequate test in advance as the reflow temperature
profile will vary according to the conditions of the parts and
boards, and the specifications of the reflow furnace.
2. Max number of reflow supported are two.
3.
Temperature uniformity inside the IR reflow oven must be
tightly controlled and multiple thermocouples should be
used. An example of possible thermocouple locations is
given in Fig. 7. The locations should also include multiple
points inside the module RF shield (for example TC1, TC5,
and TC7 in
Fig. 7). The temperature profile of all
thermocouples must meet the requirements
50
.
Содержание GainSpan GS2101M
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