GS2011M Low Power Wi-Fi Module Hardware User Guide
1VV0301482 Rev. 5.0
Page
62
of
69
2018-01-10
Figure 8 GS2011MIx Module Dimensions (in inches)
Notes:
1. All Dimensions are in inches. Tolerances shall be + 0.010 for .xxx and + 0.02 for .xx inches.
2. For Boards using PCB or Ceramic Antenna, we recommend:
–
Have Only Air on BOTH sides of antenna.
–
Hang Antenna over edge of base board (best)
–
Or Cut notch in base board under antenna area
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No metal or FR4 encircling antenna area
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Antenna at edge of base board, not interior of base board
–
Nothing conductive near antenna (e.g. battery, display, wire)
3. The 3 RF shield mounting holes and 2 test fixture alignment holes (circled in red in
) have exposed metal. These areas must not have metal
on the customer board.
4. For best RF performance, we recommend:
–
Using power(PWR) or the GND planes from module back to power supply.
–
Isolating PWR/GND from high frequency or high current components. For example, a
notch in GND plane to isolate from host uC
–
Using at least 3 vias when either power or GND changes layers. This applies particularly
at the module GND pins and at the VIN_3V3 pins.
–
Providing a 10 uF capacitor at the VIN_3V3 pin and using 3 vias both sides of the
capacitor.
Содержание GainSpan GS2011M
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