S50 Hardware User Guide
1VV0301505 Rev. 1
Page
34
of
53
2018-03-02
Re-flow Temperature-Time Profile
The data here is given only for guidance on solder and has to be adapted to your process
and other re-flow parameters for example the used solder paste. The paste manufacturer
provides a re-flow profile recommendation for his product.
Figure 22: Soldering Temperature-Time Profile (For Reflow Soldering)
Preheat
Main Heat
Peak
tsmax
tLmax
tpmax
Temperature
Time
Temperature
Time
Temperature
Time
[°C]
[sec]
[°C]
[sec]
[°C]
[sec]
150
100
217
90
260
10
230
50
Average ramp-up rate
[°C / sec]
3
Average ramp-down rate
[°C / sec]
6
Max. Time 25°C to Peak
Temperature
[min.]
8
Opposite side reflow is prohibited due to module weight.
Devices will withstand the specified profile and will withstand up to one re-flows to a
maximum temperature of 260°C. The reflow soldering profile may only be applied if the
S50 resides on the PCB side looking up. Heat above the solder eutectic point
while the S50 is mounted facing down may damage the module permanently.
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