Telink FR1 PCB Design Guideline
AN-22051900-E1 Ver. 1.0.0
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3.
Key Points of FR1 Board Design
3.1
Board layer
3.1.1
Board thickness selection
In order to reduce cost, FR1 or CEM-1 boards are generally used to produce PCB boards.
•
The thickness of FR1 board is recommended to be 1.6mm.
•
The thickness of CEM-1 board is recommended to be 1.2mm or 1.0mm.
Note:
1)
CEM-1 is more suitable for making thinner boards than FR1, and CEM-1 is less likely to warp boards
than FR1 over wave soldering.
2)
Whether FR1 or CEM-1 is used, the rules and notes for PCB design are the same.
3.1.2
Introduction of board structure
In general, FR1 circuit board is single surface board, however, we need create another layer in addition to the
Top layer and Bottom layer, called the carbon film layer. As shown in the figure below, the Key layer is the
carbon film layer.
Figure 3-1 Stack structure
