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Rev 3  

 

of 7 

 

 

  

 

 

 

CAUTION

 

 

Excessive temperatures may cause connector housing degradation or plating deterioration. 

  

 
 
 
 
 
 
 
 
 
 
 
 

 

  
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

Figure 3

 

 

 

 

 
 
 

  

 
 
 
 

 

Содержание QSFP-DD

Страница 1: ...ccepts 1 00 0 10 thick integrated circuit card housed in a plug body with alignment posts for stability of placement and needle eye pins to secure the connector on the pc board The connector is mounte...

Страница 2: ...operate in a temperature range of 55 to 85 C 67 to 185 F 3 3 Material The housing is made of liquid crystal polymer LCP thermoplastic UL 94 V 0 The contacts are made of copper alloy underplated with n...

Страница 3: ...he pc board circuit pads must be 0 03 C Circuit Pads The circuit pads must be solderable in accordance with EIA 364 52 D Layout All holes and circuit pads must be precisely located on the pc board The...

Страница 4: ...designation shall be 200 to 325 74 to 44 square micron openings respectively 6 Minimum viscosity of screen print shall be 5 10 cp centipoise 7 Minimum viscosity of stencil print shall be 7 5 10 cp ce...

Страница 5: ...Rev 3 5 of 7 CAUTION Excessive temperatures may cause connector housing degradation or plating deterioration Figure 3...

Страница 6: ...l the number at the bottom of page 1 for advice G Drying When drying cleaned assemblies and pc boards temperature limitations must not be exceeded 85 C 185 F Excessive temperatures may cause connector...

Страница 7: ...customer drawing to ensure reliable placement 6 VISUAL AID Figure 6 Visual Aid The illustration above shows a typical application of 152 position Stacked QSFP_DD pc board connector This illustration s...

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