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3.3.1

Solder joint profiles for nickel barrier termination

Good and poor solder joints caused by amount of solder in infrared reflow soldering

CeraDiodes

High-speed series

Page 16 of 25

Please read Cautions and warnings and
Important notes at the end of this document.

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Содержание High-speed Series

Страница 1: ...Type Date April 2016 EPCOS AG 2016 Reproduction publication and dissemination of this publication enclosures hereto and the information contained therein without EPCOS prior express consent is prohibi...

Страница 2: ...de Case size inch mm 3 0506 1216 4 0508 1220 5 0612 1632 6 1012 2532 Rated voltage Code VDC 040 4 050 5 5 5 6 090 9 120 12 150 15 160 16 180 18 200 20 22 300 30 360 36 480 48 700 70 900 90 201 200 Typ...

Страница 3: ...D CeraDiode Rated voltage Code VDC 0040 4 0050 5 5 5 6 0090 9 0120 12 0150 15 0160 16 0180 18 0200 20 22 0300 30 0360 36 0480 48 0700 70 0900 90 0201 200 Type A0 Standard B0 LED H0 High speed H1 Capa...

Страница 4: ...era etc EDP products desktop and notebook computer monitor PDA printer memory card control unit head set speaker HDD optical drive etc Industrial applications Mobile phone applications Design Multilay...

Страница 5: ...gle 0201 no semiconductor diode equivalent CDS1C05GTH1 B72440C0050H160 5 5 17 33 7 CDS1C05GTH2 B72440C0050H260 5 5 20 66 3 Single 0402 SOD 723 CDS2C05HDMI1 B72590D0050H160 5 6 150 0 6 0 9 CDS2C05HDMI2...

Страница 6: ...4 0 13 0 75 Array devices 4 fold array 2 4 data 1 supply Dimension in mm Case size inch mm 0506 1216 0508 1220 0612 1632 1012 2532 Min Max Min Max Min Max Min Max l 1 50 1 70 1 8 2 2 3 0 3 4 2 90 3 50...

Страница 7: ...0 8 C 0 3 0 5 1 0 1 45 Array devices 4 fold array 2 4 data 1 supply Dimensions in mm Case size inch mm 0506 1216 0508 1220 0612 1632 1012 2532 A 0 36 0 35 0 5 0 7 B 0 84 0 9 0 7 1 0 C 0 62 0 4 1 2 1 4...

Страница 8: ...P1 GND P2 GND P3 GND P4 GND P5 I O line 1 P6 I O line 2 P7 I O line 3 P8 I O line 4 2 4 data 1 supply Pin Description P1 I O line 1 P2 GND P3 I O line 2 P4 I O line 3 P5 VDC P6 I O line 4 CeraDiodes H...

Страница 9: ...Termination Single device Array device CeraDiodes High speed series Page 9 of 25 Please read Cautions and warnings and Important notes at the end of this document...

Страница 10: ...180 10000 CDS2C16GTH B72590D0160H060 0402 Cardboard 180 10000 CDS2C20GTH B72590D0200H060 0506 Blister 180 3000 CDA3C05GTH B72755D0050H062 0508 Cardboard 180 4000 CDA4C16GTH B72714D0160H060 0603 Cardbo...

Страница 11: ...to center compartment P2 2 0 0 05 2 0 2 0 2 0 2 0 0 05 Pitch of component compartments P1 2 0 0 05 2 0 4 0 4 0 4 0 0 1 Tape width W 8 0 0 3 8 0 8 0 8 0 8 0 0 3 Distance edge to center of hole E 1 75...

Страница 12: ...0 4 0 0 11 Distance center hole to center compartment P2 2 0 2 0 2 0 0 05 Pitch of component compartments P1 4 0 4 0 4 0 0 1 Tape width W 8 0 8 0 8 0 0 3 Distance edge to center of hole E 1 75 1 75 1...

Страница 13: ...cking units Case size inch mm 180 mm reel pieces 330 mm reel pieces Tape 0201 0603 15000 cardboard 0402 1005 10000 50000 cardboard 0603 1608 4000 16000 cardboard 1003 2508 4000 16000 cardboard 0506 12...

Страница 14: ...C2 Time tP 3 within 5 C of specified classification temperature Tc 20 s3 30 s3 Average ramp down rate Tp to Tsmax 6 C s max 6 C s max Time 25 C to peak temperature maximum 6 min maximum 8 min 1 Toler...

Страница 15: ...omponents on the board It is best to mount the components on the board before soldering so that one termination does not enter the oven first and the second termination is soldered subsequently The id...

Страница 16: ...ckel barrier termination Good and poor solder joints caused by amount of solder in infrared reflow soldering CeraDiodes High speed series Page 16 of 25 Please read Cautions and warnings and Important...

Страница 17: ...activated flux without preheating at 255 5 C for 10 1 s No leaching of contacts Tests of resistance to soldering heat for SMDs IEC 60068 2 58 Immersion in 60 40 SnPb for 10 s at 260 C Immersion in Sn9...

Страница 18: ...pplied smoothly to the end surface to a height of min 0 2 mm 5 5 Selection of flux Used flux should have less than or equal to 0 1 wt of halogenated content since flux residue after soldering could le...

Страница 19: ...excessively long soldering time or high soldering temperature results in leaching of the out er electrodes causing poor adhesion due to loss of contact between electrodes and termina tion Avoid manua...

Страница 20: ...aximum clamping voltage VDC VRM VRWM VWM VDC Reverse stand off voltage working voltage operating voltage VDC max Maximum DC operating voltage VESD air Air discharge ESD capability VESD contact Contact...

Страница 21: ...n if a CeraDiode has insufficient time to cool down between a number of pulses occurring within a specified isolated time period Ensure that elec trical characteristics do not degrade Consider deratin...

Страница 22: ...acks to develop on the product and its parts which might lead to reduced reliability or lifetime Mounting When CeraDiodes are encapsulated with sealing material or overmolded with plastic material be...

Страница 23: ...ontent EPCOS CeraDiodes are not suitable for switching applications or voltage stabilization where static power dissipation is required This listing does not claim to be complete it merely reflects th...

Страница 24: ...ation or other action taken by the customer e g installation of protective circuitry or redundancy that no injury or damage is sustained by third parties in the event of malfunction or failure of an e...

Страница 25: ...niCell MKD MKK MotorCap PCC PhaseCap PhaseCube PhaseMod PhiCap PQSine SIFERRIT SIFI SIKOREL SilverCap SIMDAD SiMic SIMID SineFormer SIOV SIP5D SIP5K TFAP ThermoFuse WindCap are trademarks registered o...

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