Soldering directions
1
Reflow soldering temperature profile
Recommended temperature characteristic for reflow soldering following
JEDEC J-STD-020D
Profile feature
Sn-Pb eutectic assembly
Pb-free assembly
Preheat and soak
- Temperature min
T
smin
100
°
C
150
°
C
- Temperature max
T
smax
150
°
C
200
°
C
- Time
t
smin
to t
smax
60 ... 120 s
60 ... 180 s
Average ramp-up rate
T
smax
to T
p
3
°
C/ s max.
3
°
C/ s max.
Liquidous temperature
T
L
183
°
C
217
°
C
Time at liquidous
t
L
60 ... 150 s
60 ... 150 s
Peak package body temperature
T
p
1)
220
°
C ... 235
°
C
2)
245
°
C ... 260
°
C
2)
Time (t
P
)
3)
within 5
°
C of specified
classification temperature (T
c
)
20 s
3)
30 s
3)
Average ramp-down rate
T
p
to T
smax
6
°
C/ s max.
6
°
C/ s max.
Time 25
°
C to peak temperature
maximum 6 min
maximum 8 min
1) Tolerance for peak profile temperature (T
P
) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3) Tolerance for time at peak profile temperature (t
P
) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3
CeraDiodes
High-speed series
Page 14 of 25
Please read Cautions and warnings and
Important notes at the end of this document.
