TDK High-speed Series, Руководство пользователя

Страница: 11 / 25

1 Taping and packing for chip and array CeraDiodes
1.1 Cardboard tape (taping to IEC 60286-3)
Dimensions in mm
Case size (inch) 0201
0402 0603 1003 0508 Tolerance
(mm)
0603 1005 1608 2508 1220
Compartment width A
0
0.38
±
0.05 0.6 0.95 1.0 1.6
±
0.2
Compartment length B
0
0.68
±
0.05 1.15 1.8 2.85 2.4
±
0.2
Sprocket hole diameter D
0
1.5
±
0.1 1.5 1.5 1.5 1.5 +0.1/ 0
Sprocket hole pitch P
0
4.0
±
0.1 1) 4.0 4.0 4.0 4.0
±
0.1 1)
Distance center hole to center
compartment P
2
2.0
±
0.05 2.0 2.0 2.0 2.0
±
0.05
Pitch of component compartments P
1
2.0
±
0.05 2.0 4.0 4.0 4.0
±
0.1
Tape width W 8.0
±
0.3 8.0 8.0 8.0 8.0
±
0.3
Distance edge to center of hole E 1.75
±
0.1 1.75 1.75 1.75 1.75
±
0.1
Distance center hole to center
compartment F 3.5
±
0.05 3.5 3.5 3.5 3.5
±
0.05
Distance compartment to edge G 0.75 min. 0.75 0.75 0.75 0.75 min.
Thickness tape T 0.42
±
0.02 0.6 0.9 0.95 0.95 max.
Overall thickness T
2
0.4 min. 0.7 1.1 1.1 1.10 max.
1)
≤ ±
0.2 mm over 10 sprocket holes
CeraDiodes
High-speed series
Page 11 of 25 Please read Cautions and warnings and
Important notes at the end of this document.