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Appendix B: System Specifications
Appendix B
System Specifications
Processors
3rd Gen Intel Xeon Scalable processors in a P+ (LGA-4189) socket with up to 40 cores and a thermal design power (TDP) of
up to 270W
Chipset
Intel PCH C621A
BIOS
128Mb AMI BIOS SPI Flash EEPROM
Memory
Up to 4TB of DDR4 ECC RDIMM/LRDIMM/LRDIMM 3DS with speeds up to 3200MHz in 16 slots; DIMM size up to 256GB at
1.2V
Storage Drives
24 x3.5" hot-swap SATA/SAS hybrid drive bays
(Optional) Two rear 2.5" hot-swap SATA bays
One M.2 NVMe
Two Super DOMs (disk on module) ports
PCI Expansion Slots
Three PCIe 4.0 x16 low-profile
One PCIe 4.0 x16 AIOM (see
Input/Output
LAN: Two RJ45 10G BASE-T; one RJ45 dedicated BMC LAN port
USB: Four USB 3.0 ports (Rear)
One VGA port (Rear)
One COM port (Rear)
Motherboard
X12DSC-A6; 12" (L) x 13" (W) (305mm x 330mm)
Chassis
CSE-826S2TS-R1K62P1; 4U; (WxHxD) 17.2 x 7 x 26.5 in. (437 x 178 x 673 mm)
System Cooling
Five heavy duty 8-cm fans with optimal fan speed control
One air shroud
Power Supply
Model: PWS-1K62A-1R, Two 1200W redundant modules, 80Plus Platinum Level
AC Input
1000W: 100-127Vac / 12A-15A / 50-60Hz
1200W: 200-240Vac / 7A-8.5A / 50-60Hz
+12V
Max: 83A (1000W) / Min: 0A (100Vac-127Vac)
Max: 100A (1200W) / Min: 0A (200Vac-240Vac)
+5V SB
Max: 4A / Min: 0A