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Appendix B: System Specifications
Appendix B
System Specifications
Processors
Dual 3rd Gen Intel Xeon Scalable processors in P+ (LGA-4189) sockets with up to 40 cores and a thermal design power (TDP)
of up to 270W
Chipset
Intel PCH C621A
BIOS
AMI BIOS, ACPI 3.0 or later, PCI firmware 4.0 support, BIOS rescue hot-key, SPI dual/quad speed support, RTC (Real Time
Clock) wakeup, and SMBIOS 3.0 or later
Memory
Sixteen slots for up to 6TB of LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4 or Intel Optane PMem 200 Series; up to
3200MHz; DIMM size up to 256 GB at 1.2 V.
Storage Drives
Four hot-swap 3.5" bays for SAS/SATA
Two on-board NVMe M.2 80mm
One SATADOM (disk on module)
PCI Expansion Slots
Two PCIe 4.0 x16 (FHHL) slots
Input/Output
Network: One or two AIOM modules (OCP 3.0 NIC)
BMC: Dedicated LAN port
USB: Two rear USB 3.0 ports
Video : One VGA port
COM: One serial port
Motherboard
X12DDW-A6; 12.2" (W) x 13.4" (L) ATX (312 mm x 340 mm)
Chassis
LA15TS-R860AW; 1U Rackmount, (WxHxD) 17.2" x 1.7" x 25.6" (43.7 x 4.3 x 64.8 cm)
System Cooling
Six 4-cm counter-rotating PWM fans, two CPU heatsinks, air shrouds to direct air flow
Power Supply
Model: PWS-860P-1R2, 860W redundant modules, 80Plus Platinum level
AC Input
100-127 Vac, 50-60 Hz
200-240 Vac, 50-60 Hz
200-240 Vdc,
+12V
800W, 66.6A (100 Vac–127 Vac)
860W, 71.6A (200 Vac–240 Vac)
+5V standby: 4A