Appendix C: System Specifications
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Appendix C
System Specifications
Processors
Dual Intel Xeon 82xx/62xx/52xx/42xx/32xx or 81xx/61xx/51xx/41xx/31xx processors in a P (LGA3647) socket
UPI up to 10.4GT/s; support CPU TDP 70-205W
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel C621
BIOS
AMI 32Mb SPI Flash ROM
Memory
Twenty-four slots for up to 6 TB of 3DS Load Reduced DIMM (3DS LRDIMM), 3DS Registered DIMM (3DS RDIMM), or up to
3 TB of Load Reduced DIMM (LRDIMM) with speeds of up to 2933 MHz; support for Non-Volatile DIMM (NVDIMM) and Intel
Optane DC Persistent Memory (DCPMM); DIMM size up to 256 GB at 1.2 V
Drive Bays
Twenty-four hot-swap 2.5" bays that support SAS/SATA drives by means of a required storage add-on card; four hybrid bays
can support NVMe/SAS3
(Optional) Two rear hot-swap 2.5" SATA
(Optional) M.2: 1 M.2 NVMe (2242/2260/2280*/22110*); 1 M.2 SATA (2242/2260/2280*/22110*) via optional SATA cable
PCI Expansion Slots
Two full height, double width, PCIe slots (one x8, one x16), four full height, full width x8 PCIe slots, one low profile x8 PCIe
slot, one internal low profile PCIe x8 slot (Ultra riser) Note: Model E1CR4T is different-see pg 50.
Input/Output
Network: Two to four LAN ports, varies by model
IPMI: Dedicated LAN port
USB 3.0: Two ports on the rear I/O panel (USB 0/1)
One serial port; one VGA port
DOM: Two SuperDOM (Disk on Module) port
Motherboard
X11DPU; Length 17.0", width 16.8" (431.8 mm x 426.7 mm)
Chassis
SC219U2E1C4-R1K02-T; 2U Rackmount, (WxHxD) 17.2 x 3.5 x 28.5 in. (437 x 89 x 723 mm)
System Cooling
Four 8-cm heavy duty PWM fans, two CPU heatsinks, two air shrouds to direct air flow
Power Supply
Model: PWS-1K02A-1R, 800/1000 W redundant modules, 80Plus Titanium level
Input:
100-127Vac / 9.8–7 A / 50-60 Hz
200-240Vac / 7–5 A / 50-60 Hz
+12V:
Max: 66.7 A / Min: 0 A (100-127 Vac)
Max: 83 A / Min: 0 A (200-240 Vac)
+12 V standby: Max: 2.1 A / Min: 0 A
