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Appendix B: System Specifications
Appendix B
System Specifications
Processors
3rd Generation Intel Xeon Scalable series [Socket P+ (LGA4189)] processor with up to 40 cores and a thermal design power
(TDP) of up to 270W
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel C621A
BIOS
256Mb AMI BIOS® SPI Flash BIOS
Memory
Eight slots support up to 2048GB of ECC RDIMM/LRDIMM/LRDIMM (3DS) with speeds up to 3200MHz; DIMM size up to
256GB at 1.2V
Storage Drives
Two internal SATA3 2.5" drive bays
PCI Expansion Slots
Two PCIe 4.0 x16 (FHFL)
One M.2 PCIe 3.0 x4/SATA3 Slot (supports M-Key 2280 and 22110)
Input/Output
Network: Two 10GbE LAN ports
IPMI: Dedicated LAN port
USB: Two USB 3.2 Gen 1 ports, two USB 2.0 ports
Video : One VGA port
Serial: One serial port
Motherboard
X12SPW-TF; 8" (W) x 13" (L) (203.2mm x 330.2mm)
Chassis
110P-FRN2T: CSE-515M-R804
110P-FRDN2T: CSE-515M-R601
1U Rackmount, (WxHxD) 17.2 x 1.7 x 15.7 in (437 x 43 x 398.78 mm)
System Cooling
Five 4-cm redundant, hot-swappable fans and two air shrouds to direct air flow