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Appendix B: System Specifications
Appendix B
System Specifications
Processors (per node)
Dual 3rd Gen Intel® Xeon® Scalable processors in LGA-4189 sockets; UPI up to 10.4GT/s. Supports TDP for a single
populated CPU up to 270W or for dual populated CPUs up to 185W.
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel C621A
BIOS
32MB SPI Flash memory
Memory
(per node)
16 DIMM slots for up to 2TB RDIMM/LRDIMM, DDR4-3200MHz or 4TB Intel® Optane™ Persistent Memory, DDR4-2666MHz
Storage Drives
(per node)
Six 2.5" hot-swap NVMe/SATA/SAS drive bays
Two M.2 NVMe
PCI Expansion Slots
(per node)
One AIOM (OCP 3.0) slot
One PCIe 4.0 x16 LP external slot
One PCIe 4.0 x8 internal (1x RAID or 2x M.2 NVMe) slot
Input/Output
(per node)
One COM (serial) port
Eight SATA 3.0 ports
One VGA port
Two USB 3.0 ports
Motherboard (one
per node)
X12DPFR-AN6; length 19.66", width 8.5" (499.3 mm x 215.9 mm)
Chassis
CSE-218HTS-R2K08P; 4U Rackmount, 17.63 x 6.96 x 29in. / 448 x 177 x 737mm (WxHxD)
System Cooling
(per node)
Three 4-cm heavy duty fans
One air shroud
Power Supply (four
per system)
Model: PWS-2K20A-1R, 4x Titanium Level Power Supplies (80 Plus)
AC Input Voltages: 100-240 VAC
Rated Input Current: 4.2A (100V) to 1.8A (240V)
Rated Input Frequency: 50-60 Hz
Rated Output Power: 2200W
Rated Output Voltages: +5V (18A), +3.3V (15A), +12V (29A), +5Vsb (3A), -12V (0.5A)
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 60º C (-40º to 140º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)