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STM32F042x4 STM32F042x6
Package information
113
Figure 52. Recommended footprint for TSSOP20 package
1. Dimensions are expressed in millimeters.
L1
-
1.000
-
-
0.0394
-
k
0°
-
8°
0°
-
8°
aaa
-
-
0.100
-
-
0.0039
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15mm per side.
3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not
exceed 0.25mm per side.
Table 73. TSSOP20 package mechanical data (continued)
Symbol
millimeters
inches
(1)
Min.
Typ.
Max.
Min.
Typ.
Max.
<$B)3B9