Sony XR-L500, Руководство по обслуживанию

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XR-L500/L500V/L500X
TABLE OF CONTENTS
1. GENERAL
Location of Controls ....................................................... 3
Setting the Clock ............................................................. 4
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 8
2-2. Mechanism Deck (MG-25G-136) ................................... 8
2-3. MAIN Board ................................................................... 9
2-4. Heat Sink (ISO2P) .......................................................... 9
3. ASSEMBLY OF MECHANISM DECK
3-1. Housing ........................................................................... 10
3-2. Arm (Suction) ................................................................. 10
3-3. Lever (LDG-A)/(LDG-B) ............................................... 11
3-4. Gear (LDG-FT) ............................................................... 11
3-5. Guide (C) ......................................................................... 12
3-6. Mounting Position of Capstan/reel Motor (M901) ........ 12
4. MECHANICAL ADJUSTMENTS
....................... 13
5. ELECTRICAL ADJUSTMENTS
Tape Deck Section .......................................................... 13
Tuner Section .................................................................. 13
6. DIAGRAMS
6-1. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 14
6-2. Printed Wiring Board – MAIN Board – ......................... 15
6-3. Schematic Diagram – MAIN Board (1/3) – ................... 16
6-4. Schematic Diagram – MAIN Board (2/3) – ................... 17
6-5. Schematic Diagram – MAIN Board (3/3) – ................... 18
6-6. Printed Wiring Board – SUB Board – ............................ 19
6-7. Schematic Diagram – SUB Board – ............................... 19
6-8. Printed Wiring Board
– KEY Board (XR-L500/L500X) – ................................ 20
6-9. Printed Wiring Board – KEY Board (XR-L500V) – ..... 21
6-10. Schematic Diagram – KEY Board – .............................. 22
6-11. IC Pin Function Description ........................................... 26
7. EXPLODED VIEWS
7-1. General Section ............................................................... 29
7-2. Front Panel Section ......................................................... 30
7-3. Mechanism Deck Section (MG-25G-136) ..................... 31
8. ELECTRICAL PARTS LIST
............................... 32
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
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