Sony XAV-602BT, Руководство по обслуживанию

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XAV-602BT
4
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The
fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc re
fl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(
Caution:
Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
IMPORTANT NOTE FOR REPAIRING
XAV-602BT contain individual information that the customer reg-
istered because it installs the Bluetooth function.
When repairing, the data that the customer registered might disap-
pear. Have the approval of the customer beforehand.
If any of the following repair is performed, that data disappears.
• Complete DISPLAY board exchange
• Initialize
Note: Exchanged old complete DISPLAY board is destroyed with the
hammer, and throw out it.
NOTE THE CN101 AND CN901 ON THE MAIN BOARD
REPLACING
CN101 and CN901 on the MAIN board cannot exchange with
single. When these parts are damaged, exchange the complete
mounted board.
NOTE FOR REPLACEMENT OF THE DISPLAY BOARD
When repairing, the complete DISPLAY board and should be re-
placed since any parts in the DISPLAY board cannot be repaired.
NOTE THE CN2300 ON THE M-SUB6 BOARD RE-
PLACING
CN2300 on the M-SUB6 board cannot exchange with single.
When this part is damaged, exchange the complete mounted board.
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution:
The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Label indication
Destination
Signal format
system
Region
code
Part No.
NTSC 1 4-476-945-0
[]
US and Canadian
models
PAL 2 4-476-946-0
[]
AEP and UK models
PAL 3 4-476-947-0
[]
E (PAL) model
PAL 5 4-476-948-0
[]
Indian model
PAL 5 4-476-949-0
[]
Russian model
NTSC 4 4-476-950-0
[]
E (NTSC) model
MODEL IDENTIFICATION
Part No.
Region Code
– Bottom View –
(Except E (NTSC) and Indian models)
Part No.
Region Code
– Bottom View –
(E (NTSC) and Indian models)