- 3 -
WA1
RM-Y1108
The circuit boards listed below [Table 1] used in these models
may have been processed using Lead Free Solder. The boards are
identified by the LF logo located close to the board designation
e.g. F1, H1 etc [ see examples ]. The servicing of these boards
requires special precautions to be taken as outlined below.
Table 1
CAUTION
Lead Free Soldered Boards
example 1
example 2
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints. Lead Free Solder is
available under the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This
requires soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to
http://www.sony-training.com
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Содержание WEGA KLV-20SR3
Страница 18: ... 18 WA1 RM Y1108 SECTION 2 DISASSEMBLY 2 2 STAND REMOVAL 2 1 REAR CABINET ASSEMBLY REMOVAL ...
Страница 19: ... 19 WA1 RM Y1108 2 3 REAR COVER REMOVAL 2 4 SPEAKER REMOVAL ...
Страница 20: ... 20 WA1 RM Y1108 2 5 A BOARD REMOVAL 2 6 G BOARD REMOVAL ...
Страница 21: ... 21 WA1 RM Y1108 2 7 H1 BOARD REMOVAL 2 8 H2 BOARD REMOVAL 4 3 ...
Страница 22: ... 22 WA1 RM Y1108 2 9 H3 BOARD REMOVAL 2 10 H5 BOARD REMOVAL ...
Страница 23: ... 23 WA1 RM Y1108 2 11 LCD BRACKET REMOVAL 2 12 LCD REMOVAL Four screws ...
Страница 39: ... 39 WA1 RM Y1108 UF4005PKG23 CATHODE ANODE 8 7 6 5 1 3 4 2 TDA2822D013TR TC7SET02F TE85L TL1431CZ AP TA8216H ...