1
A
B
C
D
E
F
2
3
4
5
6
7
8
9
10
11
12
13
R743
JC768
R723
R732
R504
R513
Q504
R511
Q508
R519
R518
R503
R718
R754
JC707
R724
R372
R736
R101
R109
R553
R708
R551
R757
R727
Q705
Q715
R554
Q302
Q802
Q601
IC710
Q803
D807
Q804
Q303
Q305
R818
R816
R809
R808
R819
R811
R821
R820
R826
R406
R815
R814
R817
R404
R810
R813
R812
R552
R201 R209
JC757
JC769
JC758
R705 R703
R301
R747
R719
R720
R748
JC702
R713
R749
R739
R715
R742
R721
R744
R725
R737
R704
R722
R734
R999
JC808
JC806
R733
R741
R735
JC703
JC711
C779
C720
C780,
C749
C724
C751
C711
C753
C370
C308
FB501
C723
C767
C903
C504
D511
D510
C771
C765
C773
C752
C750
C745
C303
C209
C109
11
15
IC301
20
10
1
5
C551
C728
C802
C801
C800
C406
C409
Q507
Q506
C408
C807
Q801
C810
C803
C407
C405
C410
C402
C404
C401
C806
C808
C403
C700
C716
C717
C772
C774
CN501
C712
C770
C746
C721
C732
C729
C757
IC702
IC706
IC703
C761
C102
C503
C726
L707
C550
C302
D802
D801
C104
C304
L301
C204
C202
X704
X702
1
5
10
12
36
37
40
45
48
35
30
25
IC704
IC701
13
15
20
24
CN706
CN707
1
4
8
5
3
1
2
4
5
10
1
1
4
3
2
5
CN701
IC505
IC504
1
5
2
6
10
9
20
16
15
19
24
23
1
RECHARGEABLE
BATTERY
(LITHIUM-ION)
DC IN 3.7V
5
7
1
4
IC503
8
5
1
2
5
6
9
10
15
16
19
20
D503
C
E
B
D
S
B E
C
C
C
B
E
B
G
S
D
G
C
B
E
C
C
C
B
E
B
E
E
B
C
B
E
1
2
5
3
4
B
E
C
C
E
B
B
E
C
S
G
D
EJECT
MECHANISM
BLOCK
1-675-321- 11
HP
BOARD
CN705
2
CN
BOARD
CN901
1
04
MAIN BOARD (COMPONENT SIDE)
NW-MS7
– 25 –
– 26 –
4-5. PRINTED WIRING BOARD — MAIN BOARD —
(Page 37)
Ref. No.
Location
D503
D-7
D510
D-10
D511
E-10
D801
D-13
D802
E-12
D807
E-13
IC301
B-8
IC503
E-7
IC504
E-7
IC505
E-9
IC701
E-4
IC702
C-4
IC703
C-6
IC704
E-3
IC706
B-4
• Semiconductor Location
Ref. No.
Location
IC710
C-12
Q302
B-11
Q303
B-11
Q305
B-11
Q504
D-9
Q506
D-10
Q507
D-11
Q508
E-9
Q601
C-12
Q705
B-12
Q715
B-12
Q801
D-13
Q802
C-13
Q803
C-13
Q804
E-12
Comon note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
%
: indicates tolerance.
•
f
: internal component.
•
C
: panel designation.
•
U
: B+ Line.
• Power voltage is dc 5.5 V and fed with regulated dc power
supply from external power voltage jack.
• Voltages and waveforms are dc with respect to ground in
playback mode.
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: ANALOG
J
: DIGITAL
*
IC701, 702 and 703 on main board are not
replaceable.
• The voltages and Waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
(Page 37)
surface
•
Note for replacing the parts of the main board:
IC702 and IC705 should be replaced at the same time.
•
Main board is six-layer printed board.
However, the patterns of layers 2 to 5 have not been
included in this diagrams.
*
IC701, 702 and 703 on main board are not
replaceable.
•
Lead Layouts
Comon note on Printed Wiring Boards:
•
f
: internal component.
•
b
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Lead layout of conventional IC CSP (chip size package)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side) the parts face are indicated.