4
MEX-1GP
TABLE OF CONTENTS
1.
GENERAL
Location of Controls ........................................................
5
Connections .....................................................................
5
2.
DISASSEMBLY
2-1.
Sub Panel Assy ................................................................ 12
2-2.
CD Mechanism Block ..................................................... 12
2-3.
Main Board ...................................................................... 13
2-4.
Chassis (T) Sub Assy ....................................................... 13
2-5.
Roller Arm Assy .............................................................. 14
2-6.
Chassis (OP) Assy ........................................................... 14
2-7.
Optical Pick-up ................................................................ 15
2-8.
SL Motor Assy (M902) ................................................... 15
2-9.
LE Motor Assy (M903) ................................................... 16
2-10. Servo Board ..................................................................... 16
3.
DIAGRAMS
3-1.
Block Diagram –CD Section– ......................................... 17
3-2.
Block Diagram –Memory Section– ................................. 18
3-3.
Block Diagram –Main Section– ...................................... 19
3-4.
Block Diagram –Key Section– ........................................ 20
3-5.
Circuit Boards Location .................................................. 21
3-6.
Printed Wiring Boards –CD Mechanism Section– .......... 22
3-7.
Schematic Diagram –CD Mechanism Section (1/2)– ..... 23
3-8.
Schematic Diagram –CD Mechanism Section (2/2)– ..... 24
3-9.
Printed Wiring Boards –Main Section– ........................... 25
3-10. Schematic Diagram –Main Section (1/3)– ...................... 26
3-11. Schematic Diagram –Main Section (2/3)– ...................... 27
3-12. Schematic Diagram –Main Section (3/3)– ...................... 28
3-13. Printed Wiring Board –Sub Section– .............................. 29
3-14. Printed Wiring Board –Key Section– .............................. 30
3-15. Schematic Diagram –Key Section (1/2)– ........................ 31
3-16. Schematic Diagram –Key Section (2/2)– ........................ 32
4.
EXPLODED VIEWS
4-1.
Main Section .................................................................... 44
4-2.
Front Panel Section ......................................................... 45
4-3.
CD Mechanism Section (1) ............................................. 46
4-4.
CD Mechanism Section (2) ............................................. 47
4-5.
CD Mechanism Section (3) ............................................. 48
4-6.
CD Mechanism Section (4) ............................................. 49
5.
ELECTRICAL PARTS LIST
.................................. 50
•
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°
C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Содержание MEX 1GP - Giga Panel Radio
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