- 3 -
XS1
RM-Y1011
The circuit boards listed below [Table 1] used in these models
may have been processed using Lead Free Solder. The boards are
identified by the LF logo located close to the board designation
e.g. F1, H1 etc [ see examples ]. The servicing of these boards
requires special precautions to be taken as outlined below.
Table 1
CAUTION
Lead Free Soldered Boards
example 1
example 2
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints. Lead Free Solder is
available under the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This
requires soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to
http://www.sony-training.com
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Содержание KDE-P37XS1
Страница 22: ... 22 XS1 RM Y1011 2 3 SPEAKER REMOVAL 2 4 H1 BOARD REMOVAL 1 2 3 4 1 3 2 4 ...
Страница 23: ... 23 XS1 RM Y1011 2 5 H2 BOARD REMOVAL 2 6 H3 BOARD REMOVAL 4 1 3 2 2 1 ...
Страница 24: ... 24 XS1 RM Y1011 2 7 H4 BOARD REMOVAL 2 8 HMP BOARD COVER REMOVAL 2 1 2 1 ...
Страница 25: ... 25 XS1 RM Y1011 2 9 U1 BOARD REMOVAL 2 10 APS 202 BOARD REMOVAL 2 1 2 1 ...
