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SIM2000S_Hardware_Design_V1.00
50
2014-02-27
7.3.
The Moisture Sensitivity Level
The moisture sensitivity level of SIM2000S module is 3. The modules should be mounted within 168 hours after
unpacking in the environmental conditions of temperature <30
℃
and relative humidity of <60% (RH). It is
necessary to bake the module if the above conditions are not met:
Table 48: Moisture sensitivity level and floor life
Moisture Sensitivity Level
(MSL)
Floor Life (out of bag) at factory ambient
≤
30
°
C/60% RH or as stated
1
Unlimited at
≦
30
℃
/85% RH
2
1 year
2a
4 weeks
3
168 hours
4
72 hours
5
48 hours
5a
24 hours
6
Mandatory bake before use. After bake, it must be reflowed within the time limit
specified on the label.
Note:For product handling, storage, processing, IPC / JEDEC J-STD-033 must be followed.
7.4.
Baking Requirements
SIM2000S modules are vacuum packaged, and guaranteed for 6 months storage without opening or leakage
under the following conditions: the environment temperature is lower than 40
℃
, and the air humidity is less than
90%.
If the condition meets one of the following shown below, the modules should be baked sufficiently before
re-flow soldering, and the baking condition is shown in the table below; otherwise the module will be at the risk
of permanent damage during re-flow soldering.
z
If the vacuum package is broken or leaked
;
z
If the vacuum package is opened after 6 months since it is packed
;
z
If the vacuum package is opened within 6 months but out of its Floor Life at factory ambient
≦
30
℃
/60%RH or as stated
.
Table 49: Baking requirements
Baking temperature
Moisture
Time
40 ±5
℃
℃
<5%
192 hours
120 ±5
℃
℃
<5%
6 hours
Note
:
Care should be taken if the plastic tray is not heat-resistant, the modules should be taken out for
preheating, otherwise the tray may be damaged by high-temperature heating.