UG532: ZGM230S Dev Kit User's Guide
The ZGM230S Dev Kit is a low-cost, small form factor develop-
ment and evaluation platform for the ZGM230S Z-Wave SiP Mod-
ule (System-in-Package Module).
The board is a small and cost-effective, feature-rich, prototype and development platform
based on the ZGM230S Z-Wave System-in-Package Module. The ZGM230S Dev Kit is
an ideal platform for developing energy-friendly connected IoT devices.
A built-in SEGGER J-Link debugger ensures easy debugging through the USB Type-C
connector.
TARGET DEVICE
• ZGM230S Z-Wave SiP Module
(ZGM230SB27HGN3)
• +14 dBm TX power
• -110.9 dBm RX sensitivity @100 kbps
• 32-bit ARM® Cortex®-M33 with 39 MHz
maximum operating frequency
• 512 kB flash and 64 kB RAM
• Integrated DC-DC converter
KIT FEATURES
• SMA connector for antenna connection
• Power control of on-board peripherals for
ultra-low power operation
• Relative humidity and temperature sensor
• Ambient light sensor
• Hall effect sensor
• 6-axis inertial sensor
• LC sensor for metal detection
• Pressure sensor
• 8 Mbit flash for OTA programming and
data logging
• RGB LED, two single color LEDs, and two
push buttons
• 20-pin 2.54 mm breakout pads
• Qwiic® connector
• SEGGER J-Link on-board debugger
• Virtual COM port
• Packet Trace Interface (PTI)
• Mini Simplicity connector for AEM and
packet trace using external Silicon Labs
debugger
• USB or coin cell battery powered
• External battery connector
SOFTWARE SUPPORT
• Simplicity Studio™
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