1. Introduction
The ZGM230S Dev Kit (OPN: ZGM230-DK2603A) has been designed to inspire customers to make battery-operated IoT devices with
the Silicon Labs ZGM230S Z-wave System-in-Package (SiP) Module. The highlights of the board include six different environmental
sensors accessible to the ZGM230S wireless MCU. The peripherals are grouped into power domains that can be turned on and off by
the application code as needed.
Programming the ZGM230S Dev Kit is easily done using a USB Type-C cable and the on-board J-Link debugger. A USB virtual COM
port provides a serial connection to the target application, and the Packet Trace Interface (PTI) offers invaluable debug information
about transmitted and received packets in wireless links. Included on the board is an 8 Mbit serial flash that can be used for Over-The-
Air (OTA) firmware upgrade, or as a general-purpose, non-volatile memory. The ZGM230S Dev Kit is supported in Simplicity Studio™,
and a Board Support Package (BSP) is provided to give application developers a flying start.
Energy profiling and advanced wireless network analysis and debugging tools are available through the provided Mini Simplicity Con-
nector using an external Silicon Labs debugger.
Connecting external hardware to the ZGM230S Dev Kit can be done using the 20 breakout pads, which present peripherals from the
ZGM230S Z-Wave SiP Module such as I
2
C, SPI, UART, and GPIOs. The breakout pads follow the same pinout as the expansion head-
ers (EXP) on other Silicon Labs Starter Kits. The board also features a Qwiic connector which can be used to connect hardware from
the Qwiic Connect System through I2C.
1.1 Kit Contents
The following items are included in the box:
• 1x ZGM230S Dev Kit board (BRD2603A).
• 1x 868-915 MHz antenna (LPRS ANT-SS900).
1.2 Getting Started
Detailed instructions for how to get started with your new ZGM230S Dev Kit can be found on the Silicon Labs web page:
https://www.silabs.com/dev-tools
1.3 Hardware Content
The following key hardware elements are included on the ZGM230S Dev Kit:
• ZGM230S SiP Module with 39 MHz operating frequency, 512 kB kB flash, and 64 kB RAM
• SMA antenna connector for wireless transmission
• Silicon Labs Si7021 relative humidity and temperature sensor
• Silicon Labs Si7210 Hall effect sensor
• Vishay VEML6035 ambient light sensor
• TDK InvenSense ICM-20689 6-axis inertial sensor
• Bosch Sensortec BMP384 pressure sensor
• Macronix ultra-low power 8 Mbit SPI flash (MX25R8035F)
• LESENSE metal detector LC-sensor
• Two single color LEDs and two push buttons
• RGB LED
• Power enable signals and isolation switches for ultra-low power operation
• On-board SEGGER J-Link debugger for easy programming and debugging, which includes a USB virtual COM port and Packet
Trace Interface (PTI)
• Mini Simplicity connector for access to energy profiling and advanced wireless network debugging
• Qwiic connector for connecting external hardware from the Qwiic Connect System
• Breakout pads for GPIO access and connection to external hardware
• Reset button
• Automatic switchover between USB and battery power
• CR2032 coin cell holder and external battery connector
UG532: ZGM230S Dev Kit User's Guide
Introduction
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