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6. Pin Definitions

6.1 Module Pinout

GND

PB01

PB00

PA00

PA01

PA02

PA03

PA04

PA05

PA06

DECOUPLE

GND

RF2G4_IO2

GND

RESETn

PC05

PC04

PC03

PC02

PC01

PC00

GND

VDD

PD04

PD03

PD02

PD01

PD00

Pin 1 Index

Figure 6.1. MGM210P Module Pinout

The next table shows the MGM210P pinout and general descriptions for each pin. Refer to Sections

6.2 Alternate Pin Functions

6.3 Analog Peripheral Connectivity

, and

6.4 Digital Peripheral Connectivity

for details on functions and peripherals supported by GPIOs.

Table 6.1. MGM210P Module Pin Definitions

Pin Name

No.

Description

Pin Name

No.

Description

GND

Ground

PB01

GPIO

PB00

GPIO

PA00

GPIO

PA01

GPIO

PA02

GPIO

PA03

GPIO

PA04

GPIO

PA05

GPIO

PA06

GPIO

DECOUPLE

Decouple output for on-chip voltage
regulator.

Do Not Connect

GND

Ground

VDD

Power supply

IOVDD

Digital IO power supply

PD04

GPIO

PD03

GPIO

PD02

GPIO

PD01

GPIO

PD00

GPIO

GND

Ground

PC00

GPIO

PC01

GPIO

PC02

GPIO

PC03

GPIO

PC04

GPIO

PC05

GPIO

RESETn

Reset Pin

GND

Ground

RF2G4_IO2

2.4 GHz RF input/output

GND

Ground

GND

Ground

MGM210P Wireless Gecko Multi-Protocol Module Data Sheet

Pin Definitions

silabs.com

| Building a more connected world.

Rev. 1.2 | 27

Содержание Gecko MGM210P

Страница 1: ...eral Purpose I O Pin Reset Pin Wakeup ADC Analog Comparator EM4 Shutoff Energy Management Brown Out Detector Voltage Regulator Power On Reset Security Clock Management LF RC Oscillator HF RC Oscillator EM2 HF RC Oscillator Crypto Acceleration Secure Debug Authentication Ultra LF RC Oscillator Core Memory ARM CortexTM M33 processor with DSP extensions FPU and TrustZone ETM Secure Debug RAM Memory L...

Страница 2: ...M210Px32 在活动模式 EM0 下运行功耗为 50 9 μA MHz EM2 DeepSleep 电流为 5 1 μA RTCC 从 LFXO 运行 Bluetooth 协议栈未运行 EM2 DeepSleep 电流为 8 5 μA RTCC 从 LFXO 运行 Bluetooth 协议栈运行监管认证 CE ISED FCC 韩国日本工作范围 1 71 至 3 8 V 40 至 125 C 尺寸 12 9 mm x 15 0 mm x 2 2 mm 安全通过信任根和安全加载程序 RTSL 进行的安全启动 1 通过 DPA 对策实现的硬件加密加速 1 适用于 AES128 256 SHA 1 SHA 2 高达 256 位 ECC 高达 256 位 ECDSA 和 ECDH 符合 NIST SP800 90 和 AIS 31 标准的真随机数生成器 TRNG ARM Trus...

Страница 3: ...96 20 40 to 125 C Cut Tape MGM210PB32JIA2R Zigbee OpenThread Bluetooth 5 1 20 dBm High Built in and RF pin 1024 96 20 40 to 125 C Reel All MGM210P devices operate in the 2 4 GHz ISM frequency band Refer to 4 5 RF Transmitter General Characteristics for maximum TX power figures End product manufacturers must verify that the module is configured to comply with the proper regulatory limits for each r...

Страница 4: ...ral Characteristics 14 4 6 RF Transmitter Characteristics for 802 15 4 DSSS OQPSK in the 2 4 GHz Band 15 4 7 RF Receiver General Characteristics 15 4 8 RF Receiver Characteristics for 802 15 4 DSSS OQPSK in the 2 4 GHz Band 16 4 9 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps 17 4 10 RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps 18 4 11 RF Receiver Characteristics...

Страница 5: ...et Trace Interface PTI 35 8 Package Specifications 36 8 1 Package Outline 36 8 2 PCB Land Pattern 37 8 3 Package Marking 38 9 Soldering Recommendations 39 10 Tape and Reel 40 10 1 Tape and Reel 40 10 2 Moisture Sensitivity Level 40 11 Certifications 41 11 1 Qualified Antennas 41 11 2 CE and UKCA EU and UK 41 11 3 FCC USA 41 11 4 ISED Canada 44 11 5 MIC Japan 46 11 6 KC South Korea 47 11 7 Proximit...

Страница 6: ... Block Diagram 3 2 EFR32MG21 SoC The EFR32MG21 SoC features a 32 bit ARM Cortex M33 core a 2 4 GHz high performance radio 1 MB of Flash memory a dedicated core for security a rich set of MCU peripherals and various clock management and serial interfacing options Consult the EFR32xG21 Wireless Gecko Reference Manual and the EFR32MG21A Data Sheet for details on the Secure Vault Mid MGM210PAxx device...

Страница 7: ...ault Mid is the hardware based subsystem at the core of Secure Vault that enables a subset of its features only MGM210PB part numbers support Secure Vault High and MGM210PA part numbers support Secure Vault Mid Table 3 2 Security Features and Levels Feature Secure Vault Mid High Secure Boot with Root of Trust and Secure Loader RTSL X X Cryptographic Accelerator X X ARM TrustZone X X True Random Nu...

Страница 8: ...ource as required by NIST SP800 90B and AIS 31 as well as online health tests required for NIST SP800 90C The TRNG is suitable for periodically generating entropy to seed an approved pseudo random number generator 3 5 4 Secure Debug with Lock Unlock For obvious security reasons it is critical for a product to have its debug interface locked before being released in the field In addition Secure Vau...

Страница 9: ...ate keypair and securely stores the wrapped private key into immutable OTP memory and this key never leaves the device The corresponding public key is extracted from the de vice and inserted into a binary DER encoded X 509 device certificate which is signed into a Silicon Labs CA chain and then program med back into the chip into an immutable OTP memory The secure identity can be used to authentic...

Страница 10: ...any other conditions above those indicated in the operation listings of this specification is not implied Exposure to maximum rating conditions for extended periods may affect device reliability For more information on the available quality and relia bility data see the Quality and Reliability Monitor Report at http www silabs com support quality pages default aspx Table 4 1 Absolute Maximum Ratin...

Страница 11: ... 1 71 3 0 3 8 V IOVDD operating supply volt age All IOVDD pins VIOVDD 1 71 3 0 3 8 V HCLK and Core frequency fHCLK MODE WS1 RAMWSEN 11 80 MHz MODE WS1 RAMWSEN 01 50 MHz MODE WS0 RAMWSEN 01 39 MHz PCLK frequency fPCLK 50 MHz EM01 Group A clock fre quency fEM01GRPACLK 80 MHz HCLK Radio frequency fHCLKRADIO 38 38 4 40 MHz Note 1 Flash wait states are set by the MODE field in the MSC_READCTRL register...

Страница 12: ...IEM2 Full RAM retention and RTC run ning from LFXO Bluetooth Stack not running 5 1 µA Full RAM retention RTCC run ning and Bluetooth Stack running from LFXO 8 5 µA 1 bank 16 kB RAM retention and RTC running from LFRCO 4 5 10 5 µA Current consumption in EM3 mode IEM3 Full RAM retention and RTC run ning from ULFRCO 4 8 11 4 µA 1 bank 16 kB RAM retention and RTC running from ULFRCO 4 3 µA Current con...

Страница 13: ...A Current consumption in re ceive mode Stack running IRX_LISTEN 125 kbit s 2GFSK f 2 4 GHz Bluetooth stack running 9 1 mA 500 kbit s 2GFSK f 2 4 GHz Bluetooth stack running 9 1 mA 1 Mbit s 2GFSK f 2 4 GHz Bluetooth stack running 9 1 mA 2 Mbit s 2GFSK f 2 4 GHz Bluetooh stack running 9 8 mA 802 15 4 f 2 4 GHz ZigBee stack running 9 2 mA Current consumption in transmit mode ITX f 2 4 GHz CW 10 dBm M...

Страница 14: ...odule POUT POUTMAX VDD swept from 3 0V to 3 8V 1 0 dB 10 dBm Module POUT POUTMAX VDD swept from 1 8V to 3 0V 0 2 dB Output power variation vs temperature Freq 2450MHz POUTVAR_T 20 dBm Module POUT POUTMAX VDD 3 3V tempera ture swept from 40 to 125 C 1 5 dB 10 dBm Module POUT POUTMAX VDD 3 0V tempera ture swept from 40 to 125 C 0 3 dB Output power variation vs RF frequency POUTVAR_F 20 dBm Module PO...

Страница 15: ...quency signal is DSSS OQPSK reference packet VDD 3 3 V Pout POUTMAX 2 7 rms 10 dBm Module Average across frequency signal is DSSS OQPSK reference packet Pout 10 dBm 2 7 rms 4 7 RF Receiver General Characteristics Unless otherwise indicated typical conditions are TA 25 C VDD 3 0V Measured with RF center frequency of 2 45 GHz on RF2G4_IO2 port Table 4 7 RF Receiver General Characteristics Parameter ...

Страница 16: ... 0 25 dB RSSI accuracy in the linear region as defined by 802 15 4 2003 RSSILIN 6 dB Adjacent channel rejection Interferer is reference signal 1 PER desired is refer ence signal at 3 dB above reference sensitivity level2 ACRREF1 Interferer is reference signal at 1 channel spacing 39 9 dB Interferer is reference signal at 1 channel spacing 39 2 dB Alternate channel rejection interferer is reference...

Страница 17: ...r is reference signal at 2 MHz offset1 4 3 5 48 9 dB N 3 Alternate channel se lectivity C I3 Interferer is reference signal at 3 MHz offset1 4 3 5 42 4 dB Interferer is reference signal at 3 MHz offset1 4 3 5 54 8 dB Selectivity to image frequen cy C IIM Interferer is reference signal at im age frequency with 1 MHz preci sion1 5 42 1 dB Selectivity to image frequen cy 1 MHz C IIM_1 Interferer is r...

Страница 18: ...er is reference signal at 4 MHz offset1 4 3 5 50 3 dB N 3 Alternate channel se lectivity C I3 Interferer is reference signal at 6 MHz offset1 4 3 5 54 4 dB Interferer is reference signal at 6 MHz offset1 4 3 5 55 4 dB Selectivity to image frequen cy C IIM Interferer is reference signal at im age frequency with 1 MHz preci sion1 5 8 0 dB Selectivity to image frequen cy 1 MHz C IIM_1 Interferer is r...

Страница 19: ...is reference signal at 2 MHz offset1 4 3 5 44 4 dB Interferer is reference signal at 2 MHz offset1 4 3 5 51 9 dB N 3 Alternate channel se lectivity C I3 Interferer is reference signal at 3 MHz offset1 4 3 5 44 3 dB Interferer is reference signal at 3 MHz offset1 4 3 5 58 3 dB Selectivity to image frequen cy C IIM Interferer is reference signal at im age frequency with 1 MHz preci sion1 5 44 4 dB S...

Страница 20: ... is reference signal at 2 MHz offset1 4 3 5 49 5 dB Interferer is reference signal at 2 MHz offset1 4 3 5 56 9 dB N 3 Alternate channel se lectivity C I3 Interferer is reference signal at 3 MHz offset1 4 3 5 47 0 dB Interferer is reference signal at 3 MHz offset1 4 3 5 63 1 dB Selectivity to image frequen cy C IIM Interferer is reference signal at im age frequency with 1 MHz preci sion1 5 49 5 dB ...

Страница 21: ...2 12 5 18 pF Current consumption ICL12p5 ESR 70 kOhm CL 12 5 pF GAIN3 2 AGC4 1 357 nA Startup Time TSTARTUP ESR 70 kOhm CL 7 pF GAIN3 1 AGC4 1 63 ms On chip tuning cap step size SSLFXO 0 26 pF On chip tuning capacitor val ue at minimum setting5 CLFXO_MIN CAPTUNE 0 4 pF On chip tuning capacitor val ue at maximum setting5 CLFXO_MAX CAPTUNE 0x4F 24 5 pF Note 1 Total load capacitance seen by the cryst...

Страница 22: ... 6 IOVDD V GPIO rise time TGPIO_RISE IOVDD 3 0V Cload 50pF SLEWRATE 4 10 to 90 8 4 ns IOVDD 1 7V Cload 50pF SLEWRATE 4 10 to 90 13 ns GPIO fall time TGPIO_FALL IOVDD 3 0V Cload 50pF SLEWRATE 4 90 to 10 7 1 ns IOVDD 1 7V Cload 50pF SLEWRATE 4 90 to 10 11 9 ns Pull up down resistance2 RPULL pull up MODEn DISABLE DOUT 1 pull down MODEn WIREDORPULLDOWN DOUT 0 35 44 55 kΩ Maximum filtered glitch width ...

Страница 23: ...stem For details on their electrical performance consult the relevant portions of Section 4 in the SoC s datasheet To learn which GPIO ports provide access to every peripheral consult Section 6 3 Analog Peripheral Connectivity and 6 4 Digital Pe ripheral Connectivity 4 17 Typical Performance Curves Typical performance curves indicate typical characterized performance under the stated conditions MG...

Страница 24: ...he size and shape of the application PCB the module is mounted on as well as on the proximity of any mechanical design to the antenna Figure 4 1 Typical 2D Antenna Radiation Patterns and Efficiency Top Left Phi 0o Top Right Phi 90o Bottom Left Theta 90o Bottom Right Radiation Efficiency vs Application Board GND Plane Width MGM210P Wireless Gecko Multi Protocol Module Data Sheet Electrical Specific...

Страница 25: ...Custom Designs For an example of how to enable the virtual COM port VCOM when relevant see radio board user guides UG388 or UG389 Figure 5 1 UART NCP Configuration In systems where IOVDD is not equal to VDD pin 1 of the mini simplicity debug connector should be connected to the IOVDD pin of the MGM210P module and the module should be powered through an external power supply If the host CPU is oper...

Страница 26: ...ter faces for Custom Designs For an example of how to enable the virtual COM port VCOM when relevant see radio board user guides UG388 or UG389 Figure 5 2 Stand Alone SoC Configuration Figure 5 3 Stand Alone SoC Configuration with External Antenna Note It is recommended to add an external low frequency crystal LF XTAL for Bluetooth operation MGM210P Wireless Gecko Multi Protocol Module Data Sheet ...

Страница 27: ...erals supported by GPIOs Table 6 1 MGM210P Module Pin Definitions Pin Name No Description Pin Name No Description GND 1 Ground PB01 2 GPIO PB00 3 GPIO PA00 4 GPIO PA01 5 GPIO PA02 6 GPIO PA03 7 GPIO PA04 8 GPIO PA05 9 GPIO PA06 10 GPIO DECOUPLE 11 Decouple output for on chip voltage regulator Do Not Connect 3 GND 12 Ground VDD 13 Power supply IOVDD 14 Digital IO power supply PD04 15 GPIO PD03 16 G...

Страница 28: ... GPIO TRACECLK PA05 GPIO EM4WU0 PD02 GPIO EM4WU9 PD01 LFXO LFXTAL_I LFXO LF_EXTCLK PD00 LFXO LFXTAL_O PC00 GPIO EM4WU6 PC05 GPIO EM4WU7 6 3 Analog Peripheral Connectivity Many analog resources are routable and can be connected to numerous GPIO s The table below indicates which peripherals are avali able on each GPIO port When a differential connection is being used Positive inputs are restricted t...

Страница 29: ...ailable Available I2C1 SCL Available Available I2C1 SDA Available Available LETIMER0 OUT0 Available Available LETIMER0 OUT1 Available Available PRS ASYNCH0 Available Available PRS ASYNCH1 Available Available PRS ASYNCH10 Available Available PRS ASYNCH11 Available Available PRS ASYNCH2 Available Available PRS ASYNCH3 Available Available PRS ASYNCH4 Available Available PRS ASYNCH5 Available Availabl...

Страница 30: ...R2 CC2 Available Available TIMER2 CDTI0 Available Available TIMER2 CDTI1 Available Available TIMER2 CDTI2 Available Available TIMER3 CC0 Available Available TIMER3 CC1 Available Available TIMER3 CC2 Available Available TIMER3 CDTI0 Available Available TIMER3 CDTI1 Available Available TIMER3 CDTI2 Available Available USART0 CLK Available Available Available Available USART0 CS Available Available A...

Страница 31: ...T2 CS Available Available USART2 CTS Available Available USART2 RTS Available Available USART2 RX Available Available USART2 TX Available Available MGM210P Wireless Gecko Multi Protocol Module Data Sheet Pin Definitions silabs com Building a more connected world Rev 1 2 31 ...

Страница 32: ...rator must use a unique connector such as a reverse polarity SMA or reverse thread SMA if detachable antenna is offered with the host chassis This is especially required for the FCC and ISED approvals to remain valid and any other kind of direct connector to the antenna might require a permissive change A trace length of 2 6 mm was used in the certifications host board to connect the module RF pin...

Страница 33: ...mance for modules that use the on board chip antenna This recommendation is not applicable to design cases using an external antenna Copper Clearance Area X GND plane width Figure 7 3 Non Optimal Layout Examples The width of the application PCB s GND plane under the module will impact the efficiency of the on board chip antenna To achieve optimal performance a GND plane width of 50 mm is recommend...

Страница 34: ...r 7 5 Debug See AN958 Debugging and Programming Interfaces for Custom Designs The MGM210P supports hardware debugging via 4 pin JTAG or 2 pin serial wire debug SWD interfaces It is recommended to ex pose the debug pins in your own hardware design for firmware update and debug purposes The table below lists the required pins for JTAG and SWD debug interfacing which are also presented in Section 6 2...

Страница 35: ... two output signals that can serve as a powerful debugging tool especially in conjunction with other hardware and software development tools available from Silicon Labs The PTI_DATA and PTI_FRAME signals can be accessed through any GPIO on ports C and D see FRC DOUT and FRC DFRAME peripheral resources in Table 6 4 DBUS Routing Table on page 29 MGM210P Wireless Gecko Multi Protocol Module Data Shee...

Страница 36: ...ifications 8 1 Package Outline Figure 8 1 Top and Side Views Figure 8 2 Bottom View MGM210P Wireless Gecko Multi Protocol Module Data Sheet Package Specifications silabs com Building a more connected world Rev 1 2 36 ...

Страница 37: ...mended Land Pattern for Built in Antenna Use Case Figure 8 4 Recommended Land Pattern for RF Pin Use Case MGM210P Wireless Gecko Multi Protocol Module Data Sheet Package Specifications silabs com Building a more connected world Rev 1 2 37 ...

Страница 38: ...it workweek when the device was assembled MMABCDE Silicon Labs unit code YYWWTTTTTT YY Last two digits of the assembly year WW Two digit workweek when the device was assembled TTTTTT Manufacturing trace code The first letter is the device revision Certification marks such as the CE logo FCC and IC IDs etc will be engraved on the grayed out area according to regulatory body requirements MGM210P Wir...

Страница 39: ...ed Service Electronic Products Includes products where continued performance and extended life is required and for which uninterrupted service is desired but not critical Typically the end use environment would not cause failures CLASS 3 High Performance Harsh Environment Electronic Products Includes products where continued high performance or performance on demand is critical equipment downtime ...

Страница 40: ...drant 1 upper left side of carrier with respect to the direc tion of feed indicated by the arrow in the figure Figure 10 1 Carrier Tape Dimensions Figure 10 2 Reel Dimensions 10 2 Moisture Sensitivity Level MGM210P modules are delivered in packing that conforms to moisture sensitivity level 3 MSL3 requirements MGM210P Wireless Gecko Multi Protocol Module Data Sheet Tape and Reel silabs com Buildin...

Страница 41: ... please consult your test house and or certification body for understanding the correct approach You might also want or need to get in touch with Sili con Labs for any authorization letter that your certification body might ask for 11 2 CE and UKCA EU and UK The MGM210P modules have been tested against the relevant harmonized designated standards and are in conformity with the essen tial requireme...

Страница 42: ...d product which integrates this module The end user manual shall include all required regulatory information warnings as shown in this manual OEM Host Manufacturer Responsibilities OEM Host manufacturers are ultimately responsible for the compliance of the Host and Module The final product must be reas sessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B befo...

Страница 43: ...found to comply with the limits for a Class B digital device pursuant to part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communica...

Страница 44: ...for integration into products only by OEM integrators under the following conditions The antenna must be installed such that a minimum separation distance as stated above is maintained between the radiator anten na and all persons at all times The transmitter module must not be co located or operating in conjunction with any other antenna or transmitter Important Note In the event that these condi...

Страница 45: ...r l intégration dans les produits uniquement par les intégrateurs OEM dans les conditions suivantes L antenne doit être installée de manière à maintenir une distance de séparation minimale comme indiqué ci dessus entre le radia teur antenne et toutes les personnes Le module émetteur ne doit pas être localisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur Remarque Importan...

Страница 46: ...evice which is approved for use in Japan Certification Text to be Placed on the Outside Surface of the Host Equipment Translation of the text This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law The Giteki marking shown in the following figures must be affixed to an easily noticeable section of the specif...

Страница 47: ... For FCC and ISED using the module in end products where the separation distance from the human body is smaller than that listed above is allowed but requires evaluation of the RF exposure in the final assembly and applying for a Class 2 Permissive Change or Change of ID to be applied to the existing FCC ISED approvals of the module For CE RF exposure must be evaluated using the end product in all...

Страница 48: ...ecurity components to block diagram enabled with Secure Vault Updated list of security features and corrected number of 16 bit Timer Counter from 2 x to 3 x in 1 Features Added MGM210PBxxxxxx part numbers to Table 2 1 Ordering Information on page 3 and updated footnotes Added 3 5 Security Added VCOM TX RX pin labels to J1 connector in 5 Reference Diagrams and references to UG388 UG389 for example ...

Страница 49: ...n page 27 Corrected edge alignment placement recommendation to Optional not mandatory in Figure 7 2 Recommended Layout for MGM210P Using External Antenna on page 33 Added Sections 7 4 Reset 7 5 Debug and 7 6 Packet Trace Interface PTI Renamed Section 8 1 Dimensions as 8 1 Package Outline Renamed Fig 8 1 Module Dimensions as Figure 8 1 Top and Side Views on page 36 and added Figure 8 2 Bottom View ...

Страница 50: ...h FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs A Life Support System is any product or system intended to support or sustain life and or health which if it fails can be reasonably expected to result in significant personal injury or death Silicon Labs products are not designed or authorized for military applications Silicon Labs pr...

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