
Symbol
NOM (mm)
L1
0.67 BSC
eE1
0.60 BSC
eE2
0.60 BSC
eE3
2.40 BSC
Notes
:
1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
4. The stencil thickness should be 0.100mm (4 mils).
5. The stencil aperture to land pad size recommendation is 70% paste coverage.
6. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different
parameters and fine tune their SMT process as required for their application and tooling.
BGM13S Blue Gecko
Bluetooth
®
SiP Module Data Sheet
Package Specifications
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