Siemens SITRANS P310 with HART, Краткое руководство по эксплуатации

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SITRANS P310 with HART
A5E35075329-01, 05/2015
11
Technical data (Page 34)
WARNING
Danger with "flameproof enclosure" protection
Danger of explosion in hazardous areas. An explosion may be caused by hot gas escaping from the flameproof enclosure
if there is too little space between it and the fixed parts.
•
Ensure that there is a space of at least 40 mm between the flameproof joint and the fixed parts.
①
Flameproof joint
WARNING
Loss of explosion protection
Danger of explosion in hazardous areas if the device is open or not properly closed.
•
Close the device as described in Chapter "Connecting the device (Page 20)".
WARNING
Use of incorrect device parts in potentially explosive environments
Devices and their associated device parts are either approved for different types of protection or they do not have
explosion protection. There is a danger of explosion if device parts (such as covers) are used for devices with explosion
protection that are not expressly suited for this type of protection. If you do not adhere to these guidelines, the test
certificates and the manufacturer warranty will become null and void.
•
Use only device parts that have been approved for the respective type of protection in the potentially explosive
environment. Covers that are not suited for the "explosion-proof" type of protection are identified as such by a notice
label attached to the inside of the cover with "Not Ex d Not SIL".
•
Do not swap device parts unless the manufacturer specifically ensures compatibility of these parts.
CAUTION
Hot surfaces resulting from hot process media
Danger of burns resulting from surface temperatures above 70 °C (155 °F).
•
Take appropriate protective measures, for example contact protection.
• Make sure that protective measures do not cause the maximum permissible ambient temperature to be exceeded.
Refer to the information in Chapter "Technical data (Page 34)".
CAUTION
External stresses and loads
Damage to device by severe external stresses and loads (e.g. thermal expansion or pipe tension). Process media can be
released.
• Prevent severe external stresses and loads from acting on the device.