Planning the use
3.5 Preparing for Mounting
KP8, KP8F
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Operating Instructions, 10/2010, A5E03284305-01
3.5
Preparing for Mounting
Select the HMI device mounting location
Points to observe when selecting the mounting location:
● Position the HMI device so that it is not subjected to direct sunlight.
● Position the HMI device such that it is ergonomically accessible for the user.
Choose a suitable mounting height.
● Ensure that the air vents are not covered as a result of the mounting.
● Observe the permissible mounting positions for the HMI device.
Configuration of the mounting cut-out
In order to guarantee the protective type corresponding with chapter "Insulation resistance,
protection class and degree of protection (Page 36)", the following must be complied with:
● The material at the mounting cut-out must be distortion-resistant.
● Thickness of material at the installation cut-out for protection class IP65: 2 mm up to
6 mm
● Permitted deviation from plane at the mounting cut-out: ≤ 0.5 mm
This condition must be fulfilled for the mounted HMI device.
● Permissible surface roughness in the area of the seal: ≤ 120 µm (R
z
120)
