5
Mounting
5.1
Overview of mounting procedure
•
Selecting and preparing the mounting location.
•
Mounting the device.
•
Align device towards object with bar code.
•
Connect device to data cable and supply cable.
•
Adjust the device.
5.2
Scope of delivery
The delivery of the device includes the following components:
Item
Component
Comments
1
Sensor
Depending on version
1
Set of class 2 laser warning labels in Ger‐
man/US English and French/US English
Self-adhesive for sticking over the warning
label on the device housing (if necessary)
1
Printed safety note
Included in the device packaging
Table 3: Scope of delivery
NOTE
The micro SD memory card is not included with delivery, but can be ordered from SICK
with part number 4501366.
5.3
Preparation for mounting
5.3.1
Mounting requirements
■
Typical space requirement for device: See type-specific dimensional drawing and
reading field diagram.
■
Comply with technical data, such as the permitted ambient conditions for opera‐
tion of the device (e.g., temperature range, EMC interference emissions, ground
potential),
.
■
To prevent condensation, avoid exposing the device to rapid changes in tempera‐
ture.
■
Protect the device from direct sunlight.
■
Device must only be mounted using the pairs of threaded mounting holes provided
for this purpose.
■
Shock and vibration-free mounting.
Equipment required
■
Mounting device (bracket) with sufficient load-bearing capacity and suitable
dimensions for the device.
■
2 x M5 screws
NOTE
The screws are used for mounting the device on a mounting device supplied by
the user. Screw length is dependent on the mounting base (wall thickness of the
bracket). When using an optional SICK bracket, the screws for mounting the
device are included with delivery.
■
Tool and tape measure
5
MOUNTING
24
O P E R A T I N G I N S T R U C T I O N S | CLV63x, CLV64x, CLV65x
8019588/2017-01-20 | SICK
Subject to change without notice