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Celeron™ Processor S.E.P.P. Only Retention Mechanism Assembly
Procedures
These procedures have been included to help assemble the S.E.P.P. (Single
Edge Processor Package) only Retention Mechanism.
Please follow them exactly:
Required Components
SEPP (Figure 2-12)
Heatsink (Figure 2-13)
Heatsink Retention Clip (Figure 2-14)
Primary Side
Figure 2-13
Figure 2-14
Procedures
Assemble all parts on a static free bench using
proper operator grounding and an ESD mat.
Carefully insert all four heatsink clip legs into
SEPP. (Figure 2-15)
Clip base must be located on the non-primary
side.(Figure 2-16) FYI - The side of the clip plate
which touches the substrate is covered with a
mylar insulator. This insulator prevents the clip
from shorting lines on the substrate.
Before you fully engage two legs of the clip into
the heatsink (Figure 2-17), make sure you remove
the blue film covering the thermal interface. The
blue film protects the thermal interface from
damage during shipping.
Grasp the heatsink clip assembly between the clip
base and the heatsink. Do not bend or apply
pressure directly to SEPP.
Using a nonmetallic stock or screw driver, push
the remaining two clip legs into the heatsink.
Caution:
Take care not to contact passively or
scratch SEPP when using screw driver or bar
stock.
Verify that all the feet on the clip are fully en-
gaged and seated on the heatsink. (Figure 2-18)
Non-primary Side
Non-primary Side
Primary Side
Figure 2-18
Figure 2-17
Figure 2-16
Figure 2-15
Figure 2-12