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Product Handling
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When implemented on a double-sided PCB, it should be made sure that the board side
on which mosaic-X5 is assembled is reflowed last.
Don’t use glue to attach the component
, as this might lift the component and jeopardize
bonding.
A stencil thickness of 0.1 mm / 4 mil is recommended.
Mount the part with the largest available placement nozzle, attached to the center of the
shield. Use the slowest possible speed of the pick and place machine. Preferably place
mosaic-X5 as the last component on the board.
If the motherboard thickness is 1.2 mm or less, it is recommended to support the
assembly during the reflow process to minimize bow of the motherboard.
