Shenzhen SCOTLE Technology
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http://www.scotle.com/
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chip’s interior is humid, with moisture, while welding, the water vapor
sharply spillover, cause the chip’s internal copper foil short circuit or
disconnection
. The same as PCB, seriously humid PCB is easy to cause
short circuit and serious deformation in board layers. Therefore, to some
long time storage chips, need to do drying operation, we can use BGA
rework station heating the chip(temperature about 150
℃，
time about
15min). The professional method is use the constant temperature oven, in
100
℃
,
to do
more than 10 hours drying operation on the board and chip.
Advice: purchase of moisture proof case to store the chip.(cause even
brand new chip, store in indoor environment, still absorb moisture from
the air, and
damage
5
、
How to take Glue chip?
If use the temperature (test by temperature wire) on the bottom BGA chip,
when reach to 230
℃，
the solder bal has melted.
But why couldn’t take the chip use tweezer as usual. cause the glue chip,
so should be forced to take, but hard to take it will out the point? No.
Cause the tin has melted in a liquid, but glue is not stick in the soldering
pad.
But we need to pay attention to the placement of the temperature wire:
