Shenzhen SCOTLE Technology
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Email:[email protected] Tel:8675589378931 Alice
http://www.scotle.com/
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adjust up/down the hot air, each increase 10
℃
. If the gap is larger, the
actual temperature is 195
℃
, then the bottom temperature increase 30
℃，
top increase 20
℃
,the top temperature should not increase too much, to
avoid
the thermal shock on chip is too high.
After heating completed, the fourth segment temperature reach to 217
℃，
is ideal condition
，
if exceed 220
℃
,then need to observe the chip reached
maximum temperature before the fifth segment(the highest temperature
segment)finish, the best point is not exceed 240
℃，
if more, reduce the
fifth segment temperature appropriate.
2
、
When Soldering, the PCB thimble which is on bottom bracket
can’t withstand the motherboard, and some feet withstand the
component, how do?
The PCB thimble has been designed for screw which can adjust height
via rotate, according to the different height of 6 feet, you can flexibly
adjust the height of 6 feet. Feet top to the components, can appropriate
stagger 1-2mm.
3. Functions of Air Volume Control Knob
We supply five different size air nozzle(from 25mm-40mm)
，
even the
same temperature setting, use different air nozzle, the final heating
temperature to chips is also different. The smaller air nozzle, the higher
