SATELLINE-M3-TR3,
–
TR4 and -R4
Integration Guide, Version 3.4
15
2.3
Heat transfer
While the module is operational especially when transmitter is operating, by the nature causes of
electronic circuitry, there is extensive heat production which is suggested to keep on board as minimum
as possible. Heat production is focused mainly on the board space where large metal area is exposed.
This metal plated area between the mounting holes is the area that can be used to transfer heat away
from the board. There are few alternatives to transfer heat. The simple and less effective way is to
through the host carrier board by using a heat conductive element between the module. Second method
is to conduct heat directly to some mechanical structure which can be a housing or casing of the product
or dedicated heat sink if high temperature efficiency is in demand.
Figure 4. Heat transfer area.
