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BDM-610000075
Rev B
Chapter 1: Introduction
11
Specifications
Physical Characteristics
•
Dimensions: 116mm L x 99mm W x 24mm H (4.6"L x 3.9"W x 0.95"H)
•
Weight: Approximately 0.98 Kg (0.44 lbs.) with Heatsink
Power Consumption
Exact power consumption depends on the actual application. Table 2 lists power consumption for typical
configurations and clock speeds.
Operating Conditions
Table 2
cpuModule Power Consumption
Module
Speed
RAM
Power, Typ.
Heavy CPU
Load
Heavy CPU
& Gfx Load
CMX32MVD1860
1.86 GHz
1024 MB
21.0 W
31.5 W
33.0 W
CMX32MVD1200
1.20 GHz
1024 MB
15.8 W
21.0 W
23.0 W
CMX32MCS1200
1.20 GHz
1024 MB
13.3 W
16.0 W
19.5 W
Table 3
Operating Conditions
Symbol
Parameter
Test Condition
Min.
Max.
V
CC5
5V Supply Voltage
4.75V
5.25V
V
CC3
3.3V Supply Voltage
n/a
1
1. The 12Vand ex3.3V rails are not used by the cpuModule. Any requirements on these
signals are driven by other components in the system, such as an LVDS Flat Panel or PCI device.
n/a
V
CC12
12V Supply Voltage
n/a
1
n/a
V
CCSTBY
5V Standby Voltage
2
2. 5V Standby is used to power the board when the main supply is turned off (power down modes
S3-S5). It is not required for board operation.
4.75V
5.25V
I
CCSTBY
5V Standby Current
-
500mA
Ta
Ambient Operating
Temperature
3
3. With supplied heat sink solution. Depending on the CPU usage, performance may degrade as the
ambient temperature approaches the maximum. Contact RTD Tech Support for more
information.
MVD1860
-40
+70C
Ta
Ambient Operating
Temperature
MVD1200
MCS1200
-40
+85C
Ts
Storage Temperature
-25
+85C
Rh
Humidity
Non-Condensing
0
90%
MTBF
Mean Time Before
Failure
23 C
275,000
hours
Содержание BDM-610000075
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