Rockwell Automation Publication 2071-UM001E-EN-P - November 2013
25
Install the Kinetix 3 Drive System
Chapter 2
Bonding Multiple Subpanels
Bonding multiple subpanels creates a common low impedance exit path for the
high frequency energy inside the cabinet. Subpanels that are not bonded together
can not share a common low impedance path. This difference in impedance can
affect networks and other devices that span multiple panels.
Figure 6 - Multiple Subpanels and Cabinet Recommendations
Wire Braid
25.4 mm (1.0 in.) by
6.35 mm (0.25 in.)
Remove paint
from cabinet.
Ground bus
bonded to the
subpanel.
Wire Braid
25.4 mm (1.0 in.) by
6.35 mm (0.25 in.)
Содержание Allen-Bradley Kinetix 3 2071-A10
Страница 4: ...4 Rockwell Automation Publication 2071 UM001E EN P November 2013 Summary of Changes Notes ...
Страница 8: ...8 Rockwell Automation Publication 2071 UM001E EN P November 2013 Table of Contents Notes ...
Страница 16: ...16 Rockwell Automation Publication 2071 UM001E EN P November 2013 Chapter 1 Start Notes ...
Страница 78: ...78 Rockwell Automation Publication 2071 UM001E EN P November 2013 Chapter 4 Connect the Kinetix 3 Drive Notes ...
Страница 84: ...84 Rockwell Automation Publication 2071 UM001E EN P November 2013 Chapter 5 Using the Keypad Interface Notes ...
Страница 130: ...130 Rockwell Automation Publication 2071 UM001E EN P November 2013 Appendix A Interconnect Diagrams Notes ...