UMTS/HSPA Module Series
UG96 Hardware Design
UG96_Hardware_Design 65 / 76
7
Storage, Manufacturing and
Packaging
7.1. Storage
UG96 is stored in the vacuum-sealed bag. It is rated at MSL 3 and its storage restrictions are shown as
below.
1. Shelf life in the vacuum-sealed bag: 12 months at <40ºC/<90%RH.
2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other
high temperature processes must be:
⚫
Mounted within 168 hours at the factory conditions of
≤30ºC
/
<60%RH.
⚫
Stored at <10%RH.
3. Devices require baking before mounting, if any circumstance below occurs.
⚫
When the ambient temperature is 23ºC±5ºC and the humidity indication card shows the humidity
is >10% before opening the vacuum-sealed bag.
⚫
Device mounting cannot be finished within 168 hours at factory conditions of
≤30ºC/60%RH.
4. If baking is required, devices may be baked for 8 hours at 120ºC±5ºC.
As the plastic package cannot be subjected to high temperature, it should be removed from devices
before high temperature (120ºC) baking. If shorter bake times are desired, please refer to
IPC/JEDECJ-STD-033
for bake procedure.
NOTE
