UMTS/HSPA Module Series
UG95 Hardware Design
UG95_Hardware_Design Confidential / Released 62 / 72
7
Storage and Manufacturing
7.1. Storage
UG95 is stored in the vacuum-sealed bag. The restriction of storage condition is shown as below.
Shelf life in sealed bag is 12 months at < 40ºC/90%RH.
After this bag is opened, devices that will be subjected to reflow solder or other high temperature process
must be:
Mounted within 72 hours at factory conditions of
≤ 30ºC/60%RH.
Stored at <10% RH.
Devices require bake, before mounting, if:
Humidity indicator card is >10% when read 23ºC±5ºC.
Mounted for more than 72 hours at factory conditions of
≤
30ºC/60% RH.
If baking is required, devices may be baked for 48 hours at 125ºC±5ºC.
As plastic container cannot be subjected to high temperature, module needs to be taken out from
container to high temperature (125ºC) bake. If shorter bake times are desired, please refer to
IPC/JEDECJ-STD-033 for bake procedure.
7.2. Manufacturing and Welding
The squeegee should push the paste on the surface of the stencil that makes the paste fill the stencil
openings and penetrate to the PCB. The force on the squeegee should be adjusted so as to produce a
clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil at
the hole of the module pads should be 0.13mm. For details, please refer to
document [6]
.
NOTE
Quectel
Confidential
