5G Module Series
RG255C-GL_Mini_PCIe_Hardware_Design 48 / 57
reduced performance (such as RF output power, data rate). When the maximum BB chip temperature
reaches or exceeds 105 °C, the module will disconnect from the network, and it will recover to network
connected state after the maximum temperature falls below 105 °C. Therefore, the thermal design should
be maximally optimized to make sure the maximum BB chip temperature always maintains below 95 °C.
You can execute
AT+QTEMP
and get the maximum BB chip temperature from the first returned value.
For more details of the command, see
document [3]
6.6. Notification
Please follow the principles below in the module application.
6.6.1. Coating
If a conformal coating is necessary for the module, do NOT use any coating material that may chemically
react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
6.6.2. Cleaning
Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
6.6.3. Cleaning
It is recommended to fix the module firmly when the module is inserted into a socket.
