5G Module Series
RG255C-GL_Mini_PCIe_Hardware_Design 46 / 57
Table 27: GNSS Power Consumption
6.5. Thermal Dissipation
Figure 19: Distribution of Heat Source Chips Inside the Module
The module offers the best performance when all internal IC chips are working within their operating
temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may
Description
Condition
Typ.
Unit
Searching
(
AT+CFUN=0
)
Cold start @ Passive antenna
TBD
mA
Lost state @ Passive antenna
TBD
mA
Tracking
(
AT+CFUN=0
)
Instrument environment
TBD
mA