LTE Module Series
BG96-NA Hardware Design
BG96-NA_Hardware_Design Confidential / Released 60 / 64
8.2. Manufacturing and Welding
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted
properlyso as to produce a clean stencil surface on a single pass. To ensure the module soldering quality,
thethickness of stencil for the module is recommended to be 0.18mm. For more details, please refer
to
document [5]
.
It is suggested that the peak reflow temperature is 235~245ºC (for SnAg3.0Cu0.5 alloy). The absolute
max reflow temperature is 260ºC. To avoid damage to the module caused byrepeated heating, it is
suggested that the module should be mounted after reflow soldering for the other side of PCB has been
completed. Recommended reflow soldering thermal profile is shown below.
Figure 37: Reflow Soldering Thermal Profile
8.3. Packaging
The information will be added in the
future version of this document.