LPWA Module Series
BG77 Hardware Design
BG77_Hardware_Design 72 / 76
8.3. Packaging
BG77 is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until
the devices are ready to be soldered onto the application.
The following figures show the packaging details, measured in mm.
Figure 38: Tape Dimensions
Reflow Zone
Max slope
2 to 3°C/sec
Reflow time (D: over 220°C)
40 to 60 sec
Max temperature
238°C ~ 245°C
Cooling down slope
1 to 4°C/sec
Reflow Cycle
Max reflow cycle
1