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Phytec 1488.2, Руководство по оборудованию

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PCM-065/phyCORE-i.MX8X System on Module 

 

 L-864e.A1 

 

 

 

 

 

© PHYTEC America LLC, 2021 

 

61 

12

 

Hints for Integrating and Handling the phyCORE-i.MX8X 

12.1

 

Integration 

Successful integration of the phyCORE-i.MX8X SOM into target circuitry greatly depends on adherence to the 
layout  design  rules  for  the  ground  connections  of  the  phyCORE  module.  As  a  general  design  rule,  we 
recommend  connecting  all  ground pins'  neighboring  signals  which  are  being  used  in  application  circuitry.   At 
least one ground pin should be connected for every power pin used. For maximum EMI performance, all ground 
pins should be connected to a solid ground plane. 

Additional  information  is  available  to  facilitate  the  integration  of  the phyCORE-i.MX8X  SOM  into  customer 
applications, such as: 

phyCORE-i.MX8X SOM and Carrier Board Schematic Referenc

es: 

•

 

Schematics are made available upon request 

here

.

 

phyCORE-i.MX8X Pin Resources:  

•

 

PHYTEC recommends the use of 

NXP's Pin Muxing Tool

 

•

 

The following file is a pin muxing reference for PHYTEC Hardware: 

PCM-

065_1488.2_pinmux.xlsx

 

•

 

The following file is a pin mux file for importing into NXP's Pin Muxing 
Tool: 

MIMX8QX6xxxFZ.mex

 

Phone, e-mail, FAQ, wiki, and other online support by visiting 

http://phytec.com/contact/

 

12.2

 

Modification 

Removal of various components, such as the microprocessor and the standard quartz, is not advisable given 
the compact nature of the module. Should this nonetheless be necessary, please ensure that the board as well 
as  surrounding  components  and  sockets  remain  undamaged  while  de-soldering.  Overheating  the  board  can 
cause the solder pads to loosen, rendering the SOM inoperable. Carefully heat neighboring connections in pairs. 
After a few alternations, components can be removed with the solder-iron tip. Alternatively, a hot air gun can be 
used to heat and loosen the bonds. 

WARNING:

 

If any modifications to the module are performed, regardless of their nature, the manufacturer guarantee is 
voided. 

 

Содержание 1488.2

Страница 1: ...A product of a PHYTEC Technology Holding company phyCORE i MX8X Hardware Manual Document No L 864e A1 SOM Prod No PCM 065 SOM PCB No 1488 2 CB Prod No PCM 942 CB PCB No 1491 1 Edition Feb 2021...

Страница 2: ...bility whatsoever for consequential damages resulting from the use of this manual or its associated product PHYTEC reserves the right to alter the information contained herein without prior notificati...

Страница 3: ...gram 17 6 Technical Specifications 20 7 Electrical Specifications 21 8 Minimum Requirements for Operation 22 9 Solder Jumpers 23 1 1 Solder Jumper Locations 25 2 Pin Descriptions 27 2 1 Pinout Tables...

Страница 4: ...2 UART0 51 9 Display Interfaces 52 9 1 LVDS MIPI DSI 52 9 2 Parallel LCD Display 53 10 Camera Interfaces 54 10 1 MIPI CSI 54 10 2 Parallel Camera Input Port 54 11 Peripheral Interfaces 55 11 1 ADC 55...

Страница 5: ...Component Placement processor side 18 Figure 3 phyCORE i MX8X Component Placement connector side 19 Figure 4 Three Position Solder Jumper Pad Numbering Scheme 23 Figure 5 Pinout of the phyCORE Connec...

Страница 6: ...MLB Connections at the phyCORE Connector 45 Table 24 PCIe Connections at the phyCORE Connector 45 Table 25 SAI0 Connections at the phyCORE Connector 45 Table 26 SAI1 Connections at the phyCORE Connec...

Страница 7: ...Connector 57 Table 51 GPIO3 Accessibility at phyCORE Connector 57 Table 52 GPIO4 Accessibility at phyCORE Connector 58 Table 53 GPIO5 Accessibility at phyCORE Connector 58 Table 54 GPT Signals 59 Tab...

Страница 8: ...System On Module PHYTEC System on Modules SOM and Single Board Computers SBC henceforth collectively referred to as products are designed as subcomponents for integration in electrical devices Combine...

Страница 9: ...ge in version control to accommodate new or obsolete parts Instead PHYTEC manages this at the SOM level PHYTEC ensure continued availability of pin and function compatible SOMs and SBCs further minimi...

Страница 10: ...gh level signal The hex numbers given for addresses of I2 C devices always represent the 7 most significant bits MSB of the address byte The correct value of the least significant bit LSB will depend...

Страница 11: ...ference to the available user buttons or DIP Switches on the carrier board UART Universal Asynchronous Receiver Transmitter Signal Types Different types of signals are brought out at the phyCORE Conne...

Страница 12: ...A1 PHYTEC America LLC 2021 12 PCIe Input Differential line pairs 100 Ohm PCIe level input PCIe_I PCIe Output Differential line pairs 100 Ohm PCIe level output PCIe_O MIPI CSI 2 Input Differential lin...

Страница 13: ...hieve their small size through SMD technology and multi layer PCB designs In accordance with the complexity of the module 0201 packaged SMT components and laser drilled micro vias are also used and pr...

Страница 14: ...3 0 card 2x 32KB I2 C EEPROM 2x MIPI or LVDS display 1x 18 bit parallel LCD display 1x 16 bit parallel CSI camera 1x MIPI CSI camera with 4 lanes 1x Independent 1 lane PCIe Gen3 with L1 substate suppo...

Страница 15: ...PCM 065 phyCORE i MX8X System on Module L 864e A1 PHYTEC America LLC 2021 15 3 Block Diagram Figure 1 phyCORE i MX8X Block Diagram...

Страница 16: ...tallest component on the top processor to the tallest component on the bottom phyCORE Connectors The maximum component height excluding the connector X1 is approximately 1 0 mm on the bottom connecto...

Страница 17: ...17 5 Component Placement Diagram The phyCORE i MX8X component placement diagrams presented in this manual Figure 2 and Figure 3 are for quick reference only Visit our Hardware Documentation Page for...

Страница 18: ...PCM 065 phyCORE i MX8X System on Module L 864e A1 PHYTEC America LLC 2021 18 Figure 2 phyCORE i MX8X Component Placement Processor Side...

Страница 19: ...PCM 065 phyCORE i MX8X System on Module L 864e A1 PHYTEC America LLC 2021 19 Figure 3 phyCORE i MX8X Component Placement Connector Side...

Страница 20: ...6 Technical Specifications Table 3 Technical Specifications Specification Dimensions 52 mm x 42 mm x 4 8 mm Mass 16 65g Storage Temperature 25C to 85C Operating Temperature 25C to 85C Humidity TBD Typ...

Страница 21: ...SD card 581 mA Measured while testing the following interfaces devices simultaneously via a python test script in Linux Two LCD displays plugged in and four instances of the following command were run...

Страница 22: ...OM Implement at least one of the supported boot devices to support loading and executing application software Refer to the i MX8X Processor Reference Manual for details regarding all supported boot mo...

Страница 23: ...omains to meet application requirements These domains are detailed in Table 5 Table 5 Voltage Domain Configurations Voltage Domain Jumper Associated Signals VDD_EMMC0 J10 EMMC_CLK NAND_READY_B EMMC_CM...

Страница 24: ...n to VCC_IO_3V3_1V8 J9 Sets VDD_USDHC1_VSELECT Domain 0 Ohm 1 2 Sets the VDD_USDHC1_VSELECT domain to 1 8V 2 3 Sets the VDD_USDHC1_VSELECT domain to 3 3V J10 Sets VDD_EMMC0 Domain 0 Ohm 1 2 Sets the V...

Страница 25: ...PCM 065 phyCORE i MX8X System on Module L 864e A1 PHYTEC America LLC 2021 25 1 1 Solder Jumper Locations Figure 5 Jumper Locations Processor Side...

Страница 26: ...PCM 065 phyCORE i MX8X System on Module L 864e A1 PHYTEC America LLC 2021 26 Figure 6 Jumper Locations Connector Side...

Страница 27: ...type also includes information about the signal direction CAUTION The NXP Semiconductor i MX8X is a multi voltage operated microprocessor and as such special attention should be paid to the interface...

Страница 28: ...ave multiple muxable functions As most of these pins are connected directly to the phyCORE Connector the alternative functions are available by using the phyCORE i MX8X SOM s pin muxing options Signal...

Страница 29: ...a 1 A16 X_USDHC1_DATA0 NAND_CE1_B I O 3 3VJ11 A27 USDHC1 Data 0 A17 GND Ground A18 X_USDHC1_CLK O 3 3VJ11 G23 USDHC1 Clock A19 X_USDHC1_CMD O 3 3VJ11 C25 USDHC1 Command A20 GND Ground A21 X_SPI2_CS0 I...

Страница 30: ...3V H14 USB3 Super Speed 3 Transmission Control 1 B9 GND Ground B10 X_USB3_SS3_TC2 I O 3 3V G15 USB3 Super Speed 3 Transmission Control 2 B11 X_USB3_SS3_TC3 I O 3 3V C15 USB3 Super Speed 3 Transmissio...

Страница 31: ...V AL31 Bootmode pin 2 B36 X_BOOT_MODE3 I O 1 8V AJ29 Bootmode pin 3 B37 GND Ground B38 X_ESAI0_FST ENET1_RGMII_TXD2 O 1 8V E23 ENET1 RGMII Transmit Data 2 B39 X_ESAI0_FSR ENET1_RGMII_TXC O 1 8V B26 EN...

Страница 32: ...3 3V AD32 MIPI DSI0 GPIO 0 C14 X_MIPI_DSI0_GPIO0_01 I O 3 3V AE35 MIPI DSI0 GPIO 1 C15 GND Ground C16 X_MIPI_DSI0_DATA3_N O Differential AJ15 MIPI DSI0 Data 3 Negative C17 X_MIPI_DSI0_DATA3_P O Diffe...

Страница 33: ...MIC Interupt C60 X_PMIC_WDI I 1 8V PMIC Watchdog Input C61 X_SCU_GPIO0_00 I O 1 8V Y22 System Control Unit GPIO 0 C62 X_SCU_GPIO0_01 I O 1 8V AC25 System Control Unit GPIO 1 C63 GND Ground C64 VCC_1V8...

Страница 34: ...I0_DATA3_N I Differential AN19 MIPI CSI0 Data 3 Negative D40 GND Ground D41 X_MIPI_CSI0_DATA1_P I Differential AP20 MIPI CSI0 Data 1 Positive D42 X_MIPI_CSI0_DATA1_N I Differential AM20 MIPI CSI0 Data...

Страница 35: ...C PWR_I 3 3V Main Power Supply Input D70 VCC PWR_I 3 3V Main Power Supply Input J6 The voltage level for this signal is configurable for 1 8V or 3 3V via J6 The default voltage level is listed here bu...

Страница 36: ...o backup the Secure Non Volatile Storage which includes the RTC a secondary voltage source of 3V can be supplied to the phyCORE i MX8X SOM at the VBAT pin pin C66 of phyCORE Connector X1 The PMIC goes...

Страница 37: ...Table 13 Internal Voltage Rails Schematic Signal Voltage V Function VCC_SNVS 3 0 i MX8X Secure Non Volatile Storage VCC_MAIN 1 0 i MX8X Core VCC_GPU 1 1 i MX8X GPU VCC_CPU 1 1 i MX8X CPU VCC_DDRIO 1 1...

Страница 38: ...t address 0x52 0x56 4 3 eMMC Flash An eMMC flash device is populated at U4 as a programmable nonvolatile storage The eMMC flash is connected to the EMMC0 8 bit interface of the i MX8X which supports e...

Страница 39: ...e 0 USDHC1_DATA1 NAND_RE_B O 3 3VJ10 B26 NAND Read Enable USDHC1_DATA0 NAND_CE1_B O 3 3VJ10 A27 NANE Chip Enable 11 USDHC1_DATA3 NAND_ALE O 3 3VJ10 E25 NAND Address Latch Enable USDHC1_DATA2 NAND_WE_B...

Страница 40: ...on board eMMC at U4 The USDHC1 port provides a 4 bit wide data bus that supports embedded MultiMedia Card 5 1 SD Host Processor Standard Specification 3 0 SD Physical Layer Specification v3 0 UHS I SD...

Страница 41: ...purposes the BOOTMODE pins are available at the phyCORE Connector These signals are strapped to default values using on board resistors The default configuration is 0010 and the default setting is to...

Страница 42: ...10 BASE Te 100BASE TX and 1000BASE T protocols to interface directly to twisted pair media through an external transformer CAUTION Only ENET0 is translated with a DP83867 The ENET1 signals are not It...

Страница 43: ...SCKT ENET1_RGMII_TXD3 O 3 3V C25 ENET1 RGMII Transmit Data 3 B42 X_ESAI0_SCKR ENET1_RGMII_TX_CTL O 3 3V H22 ENET1 RGMII Transmit Control B43 X_ESAI0_TX0 ENET1_RGMII_RXC I 3 3V G23 ENET1 RGMII Receive...

Страница 44: ...X_MIPI_DSI0_I2C0_SCL OD O 3 3V W27 MIPI DSI0 I2C0 Clock C11 MIPI DSI0 I2C0 SDA X_MIPI_DSI0_I2C0_SDA OD I O 3 3V V22 MIPI DSI0 I2C0 Data C41 MIPI DSI1 I2C0 SCL X_MIPI_DSI1_I2C0_SCL OD O 3 3V AE33 MIPI...

Страница 45: ...Request B31 X_PCIE_CTRL_WAKE_B 3 3V A11 PCIe Link Reactivation 6 6 SAI and ESAI The phyCORE i MX8X SOM provides four Serial Audio Interfaces SAI and an Enhanced Serial Audio Interface ESAI The SAI mo...

Страница 46: ...M22 Audio DMA Master Clock IN1 A55 MCLK_OUT0 X_MCLK_OUT0 O 3 3V K24 Audio DMA Master Clock Out Table 30 ESAI0 Connections at the phyCORE Connector X1 Pin Processor Signal SOM Signal Type Level Proces...

Страница 47: ...ock A26 SPI0_CS0 X_SPI0_CS0 I O 3 3V R33 SPI0 Chip Select 0 A28 SPI0_CS1 X_SPI0_CS1 I O 3 3V R35 SPI0 Chip Select 1 A29 SPI0_SDO X_SPI0_SDO O 3 3V R31 SPI0 Data Out A30 SPI0_SDI X_SPI0_SDI I 3 3V P34...

Страница 48: ...ration The USB 2 0 module is compliant with On The Go OTG supplement and the USB 3 0 is compliant with the USB 3 0 and USB 2 0 with OTG supplement specification USB1 is a separate independent USB 2 0...

Страница 49: ...G Connections at the phyCORE Connector X1 Pin SOM Signal Type Level Processor Ball Description B1 USB_OTG2_VBUS A I 5V H16 USB OTG2 VBUS input B2 X_USB_OTG2_ID A I 3 3V F16 USB OTG2 2 0 Dual Role Devi...

Страница 50: ...M4F GPIO3 D61 M4F_GPIO4 X_ADC_IN4 I O 1 8V W29 M4F GPIO4 D61 M4F_TPM_CH0 X_ADC_IN4 O 1 8V W29 M4F Temperature Monitor Channel 0 D64 M4F_GPIO5 X_ADC_IN5 I O 1 8V V34 M4F GPIO5 D64 M4F_TPM_CH1 X_ADC_IN...

Страница 51: ...ble 39 JTAG Connections at the phyCORE Connector X1 Pin SOM Signal Type Level Processor Ball Description D51 X_JTAG_TCK I 1 8V AE31 JTAG Test Clock D52 X_JTAG_TDO O 1 8V AF32 JTAG Test Data Output D53...

Страница 52: ...Data 1 Positive C21 X_MIPI_DSI0_DATA0_N O Differential AJ21 LVDS0 MIPI DSI0 Data 0 Negative C22 X_MIPI_DSI0_DATA0_P O Differential AK22 LVDS0 MIPI DSI0 Data 0 Positive C23 X_MIPI_DSI0_DATA2_N O Differ...

Страница 53: ...I0_TX2_RX3 ENET1_RGMII_RXD2 O 1 8V C27 LCD Data 6 B47 LCD_D7 X_ESAI0_TX3_RX2 ENET1_RGMII_RXD1 O 1 8V D24 LCD Data 7 B48 LCD_D8 X_ESAI0_TX4_RX1 ENET1_RGMII_TXD0 O 1 8V B28 LCD Data 8 B49 LCD_D9 X_ESAI0...

Страница 54: ...I0 Data 2 Positive D49 X_MIPI_CSI0_DATA2_N I Differential AN23 MIPI CSI0 Data 2 Negative D38 X_MIPI_CSI0_DATA3_P I Differential AR19 MIPI CSI0 Data 3 Positive D39 X_MIPI_CSI0_DATA3_N I Differential AN...

Страница 55: ...vel Processor Ball Description A50 FTM_CH0 X_UART2_RX I O 1 8V AD34 FlexTimer Channel 0 A51 FTM_CH1 X_UART2_TX I O 1 8V AC35 FlexTimer Channel 1 11 3 GPIO The General Purpose Input Output interface pr...

Страница 56: ...59 GPIO0_14 X_SPI3_SDO I O 1 8V1 G25 B58 GPIO0_15 X_SPI3_SDI I O 1 8V1 H24 B55 GPIO0_16 X_SPI3_CS0 I O 1 8V1 D26 A53 GPIO0_19 X_MCLK_IN0 I O 1 8V1 L23 A55 GPIO0_20 X_MCLK_OUT0 I O 1 8V1 K24 A60 GPIO0_...

Страница 57: ...s LDO4 domain The default voltage level is listed here but always check the actual voltage setting for the applicable SOM configuration Table 50 GPIO2 Accessibility at phyCORE Connector X1 Pin Process...

Страница 58: ...DHC1_DATA3 NAND_ALE I O 1 8VJ11 E25 1 The voltage level for these signals is configurable between 1 8V or 3 3V using the PMIC s LDO4 domain The default voltage level is listed here but always check th...

Страница 59: ...V AL9 KPP Column 2 D8 KPP0_COL3 X_QSPI0_DATA6 I O 1 8V AJ11 KPP Column 3 D9 KPP0_ROW0 X_QSPI0_DATA7 I O 1 8V AM8 KPP Row 0 C9 KPP0_ROW1 X_QSPI0B_DQS I O 1 8V AL11 KPP Row 1 C6 KPP0_ROW2 X_QSPI0B_SS0_B...

Страница 60: ...el Processor Ball Description D14 TAMPER_OUT0 X_CSI_DO0 I O 1 8V AK28 Tamper Out 0 D15 TAMPER_OUT1 X_CSI_DO1 I O 1 8V AL29 Tamper Out 1 D16 TAMPER_OUT2 X_CSI_DO2 I O 1 8V AP30 Tamper Out 2 D17 TAMPER_...

Страница 61: ...CORE i MX8X Pin Resources PHYTEC recommends the use of NXP s Pin Muxing Tool The following file is a pin muxing reference for PHYTEC Hardware PCM 065_1488 2_pinmux xlsx The following file is a pin mux...

Страница 62: ...1 62 Revision History Table 60 Document Revision History Date Version Number Changes in this Manual 2020 05 20 L 864e A0 Preliminary Release 2021 02 12 L 864e A1 SOM PCB revision from 1488 1 to 1488 2...

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