PCB Arts GmbH
Instruction Manual Vapor Phase One
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7
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27
formed. This then has an identical temperature to the boiling temperature of the inert
medium. This vapor layer thus also defines a large part of the soldering zone. When the
specified temperature profile provides for the soldering temperatures, the assembled
assembly is moved into the vapor layer. The vapor condenses on the surface of the solder as
this is lower than the boiling temperature. The condensation process is finished as soon as
the soldering material has reached the temperature of the steam.
The soldering grid with the soldering material is moved upwards in the process chamber,
and the cooling process of the process chamber begins. The process chamber is cooled down
with the help of fans, which ensures almost complete condensation of the remaining
medium vapor. Once a certain temperature of the medium has been reached, the process
chamber is released for opening. The user can now open the process chamber via touch
panel and remove the still warm or hot solder with cotton gloves.
1.5
The heat transfer medium
PCB Arts uses the process medium of the company "Solvay Solexis" with the brand name
"Galden®". This is perfluoropolyether, which is composed exclusively of carbon, fluorine and
oxygen atoms. The advantages of Galden© are:
•
Dielectric properties
•
High material compatibility
•
No flash point
•
High heat transfer coefficient
•
Not a hazardous substance in the sense of occupational health and safety
1.6
Footprint
The
"Vapor Phase One" must be set up with at least 20cm of protrusion all around. Thus, an
installation area of 900mm (width) x 700mm (depth) x 900mm (height) is required. The
installation surface must be horizontal and temperature resistant (at least 150°C). Ideally,
the soldering machine should be placed near a window to prevent odors from developing.
The temperature of the operating room must not exceed 35°C. Also, the humidity of the air
must not exceed 70%.
Make sure that the vapor phase soldering system has enough space
above the lid so that there is no danger of crushing.
•
The soldering unit must not be installed near fire detectors or sprinkler systems.
•
The soldering system must not be operated in potentially explosive atmospheres.
•
With the
mains plug disconnected, the
cooling water reservoir is to be filled up to
the specified level with distilled water only.
•
The process medium reservoir must be filled up to the specified level with the
power
plug disconnected
; the heating coils at the bottom of the solder pot must
always be
covered.
